-

HyperLight Demonstrates Low-Power 1.6T-DR8 TFLN-based Reference Transceiver Assembled by TFC

CAMBRIDGE, Mass.--(BUSINESS WIRE)--HyperLight Corporation (“HyperLight”) today announced a major milestone in low-power optical networking with the demonstration of a 1.6T-DR8 optical transceiver leveraging HyperLight’s TFLN Chiplet™ Platform.

Even at the current 200Gbps-per-lane generation, TFLN can already deliver massive power savings. At the scale of modern AI data centers, that translates into megawatts of potential energy reduction.

Share

The reference module was demonstrated with engineering and manufacturing support from Suzhou TFC Optical Communication Co., Ltd. (SZSE: 300394, or "TFC"). The reference design achieves 20W power consumption in a fully retimed 1.6T-DR8 module, representing approximately 20% lower module-level power compared to alternative technologies. The reduction is achieved through a simple drop-in transmitter implementation based on a single thin-film lithium niobate photonic integrated circuit (TFLN PIC).

The TFLN transmitter enables the module to operate using a single continuous-wave (CW) laser, compared to the two to four lasers typically required in conventional implementations. Additional energy savings are achieved through the ability to operate directly from the native low-swing electrical output of the DSP, enabled by the low drive voltage of TFLN modulators.

“TFLN is a key technology for future 400Gbps-per-lane optical systems,” said Mian Zhang, CEO of HyperLight. “What we are demonstrating today is that even at the current 200Gbps-per-lane generation, TFLN can already deliver massive power savings. At the scale of modern AI data centers, that translates into megawatts of potential energy reduction. Our work with TFC demonstrates how readily HyperLight’s technology can integrate into existing optical module ecosystems.”

HyperLight will demonstrate the module live at OFC 2026, taking place March 16–18 in Los Angeles, California.

About HyperLight

HyperLight delivers high-performance integrated photonics solutions based on thin-film lithium niobate technology. The company combines the electro-optic advantages of TFLN with scalable manufacturing, test, and integration to enable next-generation optical engines for AI data centers, telecom and metro networks, and emerging photonics markets.

Website: https://www.hyperlightcorp.com

Contacts

Media
HyperLight
Joe Balaban
info@hyperlightcorp.com

More News From HyperLight Corporation

HyperLight Welcomes VentureTech Alliance to Series C, Deepening TFLN Integration Across the Semiconductor Ecosystem

CAMBRIDGE, Mass.--(BUSINESS WIRE)--HyperLight Corporation ("HyperLight"), a leader in thin-film lithium niobate (TFLN) photonics, today announced that VentureTech Alliance ("VTA") has joined its Series C financing round. VTA is a venture investment firm focused on the semiconductor industry, with a portfolio built across the semiconductor technology stack — including circuit design, foundry-adjacent process technology, EDA, advanced packaging, and photonics. VTA's participation extends the ecos...

HyperLight Announces $80 Million Series C to Accelerate TFLN Deployment for AI Infrastructure

CAMBRIDGE, Mass.--(BUSINESS WIRE)--HyperLight Corporation (“HyperLight”), a leader in thin-film lithium niobate (TFLN) photonics, today announced the closing of an $80 million Series C financing round led by MediaTek. The round includes participation from UMC Capital, Jabil, Foxconn, EDBI (arm of SG Growth Capital, the investment platform of the Singapore Economic Development Board and Enterprise Singapore), CDIB-TEN Capital, and Qatar Investment Authority (QIA), as well as strategic investors...

HyperLight Introduces 400G-per-lane PICs on its TFLN Chiplet™ Platform for Next-Generation AI Interconnects

CAMBRIDGE, Mass.--(BUSINESS WIRE)--HyperLight Corporation (“HyperLight”), creator of the TFLN Chiplet™ Platform, today announced the availability of 400G-per-lane thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) designed for next-generation AI networking infrastructure. The new PIC family delivers low insertion loss, low drive voltage operation, and exceptional electro-optic bandwidth, enabling energy-efficient and high-performance 400G-per-lane optical links. The transition...
Back to Newsroom