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Semiconductor
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Leon Stok of IBM Elected Chair of Silicon Integration Initiative Board

AUSTIN, Texas--(BUSINESS WIRE)--The Silicon Integration Initiative (Si2) today announced that Dr. Leon Stok, Vice President of Electronic Design Automation at IBM, has been elected Chair of the Si2 Board of Directors for the remainder of the 2025–2026 term. Dr. Stok has served on the Board of Si2 since 2007, previously holding several leadership roles, including prior terms as Board Chair. At IBM, he leads a team that delivers world-class design and verification flows and tools used to create s...
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Vantage Data Centers Appoints Robin Balen as Chief Product Officer to Lead Newly Created Product Organization

DENVER--(BUSINESS WIRE)--Vantage Data Centers, a leading global provider of hyperscale data center campuses, today announced the appointment of Robin Balen as chief product officer (CPO) to lead the company’s recently created product organization. A seasoned technology and business leader with more than 25 years of experience, Balen will spearhead Vantage’s global product vision and roadmap, partnering across regions and functions to accelerate and scale innovation and deliver world-class solut...
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IDEX Corporation Appoints Sean Gillen as SVP, Chief Financial Officer

NORTHBROOK, Ill.--(BUSINESS WIRE)--IDEX Corporation announces Sean M. Gillen as Senior Vice President and Chief Financial Officer, effective January 5, 2026....
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Cirrus Logic to Present at Upcoming Conference

AUSTIN, Texas--(BUSINESS WIRE)--Cirrus Logic, Inc. (Nasdaq: CRUS) announced that President and Chief Executive Officer John Forsyth and Chief Financial Officer Jeff Woolard will present at the Barclays Annual Global Technology Conference in San Francisco, California on December 11, 2025 at 1:55 p.m. PT. A live webcast and replay of the event will be available on the company's investor relations website. Cirrus Logic, Inc. Cirrus Logic is a leader in low-power, high-precision mixed-signal proces...
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AWS Introduces Graviton5—the Company’s Most Powerful and Efficient CPU

LAS VEGAS--(BUSINESS WIRE)--At AWS re:Invent, Amazon Web Services, Inc. (AWS), an Amazon.com, Inc. company (NASDAQ: AMZN), today announced Amazon EC2 M9g instances powered by the new Graviton5 chip. Key takeaways New AWS Graviton5-based Amazon EC2 M9g instances deliver up to 25% higher performance than the previous generation. With 192 cores per chip and 5x larger cache, customers can scale up workloads and improve application performance while reducing infrastructure cost. For the third year i...
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Mouser Electronics Announces Partnership with DS PENSKE for Formula E Season 12 with Debut in Brazil

DALLAS & FORT WORTH, Texas--(BUSINESS WIRE)--Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, is proud to sponsor the DS PENSKE Formula E racing team as they begin Season 12 at the Sambadrome in São Paulo, Brazil, on December 6. Mouser is sponsoring the team throughout the 2025/2026 ABB FIA Formula E World Championship racing season in collaboration with TTI, Inc., and valued manufacturers Molex and KYOCERA AVX. The race will see record-breaking rookie...
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Rigaku Launches XTRAIA MF-3400, a Measuring Instrument for Next-generation Semiconductors

TOKYO--(BUSINESS WIRE)--Rigaku Corporation, a global solution partner in X-ray analytical systems and a group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) has launched the XTRAIA MF-3400, an instrument used in semiconductor manufacturing processes to measure the thickness and composition of wafers. The XTRAIA MF-3400 will significantly enhance productivity in the rapidly growing semiconductor market by enabling high-accuracy eva...
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Data I/O Announces Strengthening of Board of Directors

REDMOND, Wash.--(BUSINESS WIRE)--Data I/O Announces Strengthening of Board of Directors Edward Smith Appointed Chair of the Board; Steven Waszak Appointed as Independent Director...
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5.5V, 4A, Low IQ Synchronous Buck Converter with Versatile I2C Interface from Diodes Incorporated is Optimized for Efficiency and Size in Automotive POL Systems

PLANO, Texas--(BUSINESS WIRE)--Diodes Incorporated (Diodes) (Nasdaq: DIOD) today introduces the AP61406Q, a new 5.5V, 4A member with I2C interface of its low quiescent current (IQ), automotive-compliant* synchronous buck converters. The I2C interface allows the programming of various parameters enabling it to meet the growing demand for compact design and high efficiency in various automotive point-of-load (POL) applications, including infotainment, instrument clusters, telematics, and advanced...
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Wizerr AI Launches the Agentic BOM Engine for Electronics Manufacturing, Built with NVIDIA

SAN FRANCISCO--(BUSINESS WIRE)--Wizerr debuts the Agentic BOM Engine, a multi-agent workflow for electronics manufacturing powered by a patent-pending Component Intelligence Layer....