-

HyperLight Introduces 110 GHz Reference IQ Modulators covering optical O, C and L wavelength bands for 240 GBaud Class Applications

CAMBRIDGE, Mass.--(BUSINESS WIRE)--HyperLight, creator of the TFLN Chiplet platform, today announced the launch of the industry’s first 110 GHz IQ packaged modulators, available in both standard and low-Vπ versions. These 110 GHz IQ modulators mark another industry milestone by enabling next-generation 240 GBaud+ coherent optical communication and advanced test systems with unprecedented performance.

A record low half-wave voltage as low as 1.7 V, optimized for the limited voltage swing of high-baud-rate Arbitrary Waveform Generator (AWG) systems.

Share

The new IQ modulators are the first of their kind to provide 125 GHz operational bandwidth. They also feature a record low half-wave voltage as low as 1.7 V, optimized for the limited voltage swing of the high-baud-rate Arbitrary Waveform Generator (AWG) systems. They deliver the bandwidth and signal fidelity required for 240 GBaud-class transmission and ultra-high-speed testing environments. These 110 GHz IQ modulators have been delivered to customers worldwide.

Key Features of HyperLight’s 110 GHz IQ Modulators:

  • Single-polarization IQ modulator
  • 125 GHz operational bandwidth
  • Supports 240 GBaud signaling
  • IQ automatic bias controller available, designed for TFLN thermal phase shifter
  • Coverage across C/L-band and O-band

Target Applications include:

  • 240 GBaud coherent testing
  • 110 GHz single sideband modulation

‘With 240 GBaud coherent applications on the horizon, the launch of our 110 GHz IQ Modulator gives customers early and straightforward access to the golden transmitters essential for next-generation coherent testing and development,” says Mian Zhang, CEO of HyperLight, “This breakthrough builds on our proven, high-volume TFLN Chiplet™ platform, the same foundation behind our leading coherent chiplet products. By uniting these technologies, we provide customers with the confidence and flexibility to access the industry’s best commercial-scale TFLN capability, precisely at the form factor and the scale their needs demand.”

The new 110 GHz IQ modulators expand HyperLight’s growing portfolio of ultra-high-speed electro-optic devices, complementing its 110 GHz Intensity and Phase modulator product lines. The launch further underscores HyperLight’s leadership in thin-film lithium niobate (TFLN) technology and its commitment to delivering the future of ultra-fast, energy-efficient optical communications.

For more information about how HyperLight is shaping the future of integrated photonics and optical modulation technology, visit hyperlightcorp.com.

About HyperLight

Headquartered in Cambridge, Massachusetts, HyperLight delivers high-performance integrated photonics solutions built on its TFLN Chiplet™ platform. By uniquely combining the superior electro-optic properties of thin-film lithium niobate (TFLN) with scalable CMOS-compatible manufacturing processes, HyperLight's solutions provide unprecedented bandwidth, ultra-low loss, and exceptional energy efficiency. These seamlessly integrated solutions empower groundbreaking innovations in AI, data centers, telecommunications, quantum computing, and emerging technologies.

Contacts

For media inquiries, please contact: info@hyperlightcorp.com

For product & service inquiries, please contact: sales@hyperlightcorp.com

HyperLight


Release Versions

Contacts

For media inquiries, please contact: info@hyperlightcorp.com

For product & service inquiries, please contact: sales@hyperlightcorp.com

Social Media Profiles
More News From HyperLight

HyperLight Welcomes VentureTech Alliance to Series C, Deepening TFLN Integration Across the Semiconductor Ecosystem

CAMBRIDGE, Mass.--(BUSINESS WIRE)--HyperLight Corporation ("HyperLight"), a leader in thin-film lithium niobate (TFLN) photonics, today announced that VentureTech Alliance ("VTA") has joined its Series C financing round. VTA is a venture investment firm focused on the semiconductor industry, with a portfolio built across the semiconductor technology stack — including circuit design, foundry-adjacent process technology, EDA, advanced packaging, and photonics. VTA's participation extends the ecos...

HyperLight Announces $80 Million Series C to Accelerate TFLN Deployment for AI Infrastructure

CAMBRIDGE, Mass.--(BUSINESS WIRE)--HyperLight Corporation (“HyperLight”), a leader in thin-film lithium niobate (TFLN) photonics, today announced the closing of an $80 million Series C financing round led by MediaTek. The round includes participation from UMC Capital, Jabil, Foxconn, EDBI (arm of SG Growth Capital, the investment platform of the Singapore Economic Development Board and Enterprise Singapore), CDIB-TEN Capital, and Qatar Investment Authority (QIA), as well as strategic investors...

HyperLight Introduces 400G-per-lane PICs on its TFLN Chiplet™ Platform for Next-Generation AI Interconnects

CAMBRIDGE, Mass.--(BUSINESS WIRE)--HyperLight Corporation (“HyperLight”), creator of the TFLN Chiplet™ Platform, today announced the availability of 400G-per-lane thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) designed for next-generation AI networking infrastructure. The new PIC family delivers low insertion loss, low drive voltage operation, and exceptional electro-optic bandwidth, enabling energy-efficient and high-performance 400G-per-lane optical links. The transition...
Back to Newsroom