-

OIF Champions Interoperability at ECOC 2024: 34 Member Companies to Showcase Solutions for Data Centers, AI/ML Technologies and Disaggregated Systems

Demos include 800ZR, 400ZR and multi-span optics, Energy Efficient Interfaces (EEI) & co-packaging, 224G and 112G Common Electrical I/O (CEI) and Common Management Interface Specification (CMIS)

FREMONT, Calif.--(BUSINESS WIRE)--OIF is set to lead a dynamic interoperability demonstration featuring live collaboration between 34 member companies at the upcoming ECOC 2024 exhibition being held Sept. 23-25 in Frankfurt, Germany. This showcase will highlight advancements in performance, efficiency and capacity in response to the burgeoning needs of future-oriented data centers, AI/ML technologies and disaggregated systems.

The demonstration, in Booth #B83, will spotlight interoperability innovations in 800ZR, 400ZR and multi-span optics, Energy Efficient Interfaces (EEI) & co-packaging, 224G and 112G Common Electrical I/O (CEI) and Common Management Interface Specification (CMIS) – all pivotal for shaping the next decade of industry standards.

“OIF’s interoperability demonstrations at this year’s ECOC are a testament to the collaborative efforts of our member companies in enabling next-generation connectivity solutions,” said Nathan Tracy, OIF President, and TE Connectivity. “Our focus on advanced solutions underscores our commitment to addressing the future networking needs driven by evolving technologies like AI/ML.”

The interoperability demonstrations will showcase system, component and test-equipment vendors and highlight their roles in driving the adoption of advanced technologies in near-term and next-generation networks.

Participating member companies include Adtran; Alphawave Semi; Amphenol; Anritsu; AOI; Astera Labs; Cadence Design Systems, Inc.; CICT/Accelink; Cisco; Coherent Corp.; EXFO; HG Genuine; Hisense; Infinera; Innolight; Juniper Networks; Keysight Technologies; Lessengers; Linktel Technologies; Lumentum; MACOM Technology Solutions; Marvell; Molex; MultiLane; Nokia; O-Net Technologies; Samtec; Semtech; Senko Advanced Components; Sumitomo Electric Industries; Synopsys; TE Connectivity; USConec and Wilder Technologies.

For further details, please visit: https://www.oiforum.com/meetings-events/oif-ecoc-2024/

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at https://www.oiforum.com/.

Contacts

Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010

More News From OIF

OIF Validates AI-Era Interoperability Live at ECOC 2026 Through Multi-Vendor Demonstrations and Expert Sessions

FREMONT, Calif.--(BUSINESS WIRE)--OIF will bring together 39 of its member companies at the ECOC 2026 Exhibition, September 21–23 in Malaga, Spain, to showcase the interoperable building blocks required to scale AI-era networks. Through live, multi-vendor demonstrations at booth #2126, OIF members will show how industry collaboration translates specifications into working implementations across optical systems, high-speed electrical interfaces, module management, co-packaging and energy-efficie...

OIF Brings Industry-Wide Interoperability to Life at ECOC 2026, Accelerating Scalable, Efficient Networks for the AI Era

FREMONT, Calif.--(BUSINESS WIRE)--OIF, where the optical networking industry’s interoperability work gets done, today announced its live, multi-vendor interoperability demonstration for the ECOC 2026 Exhibition being held September 21 - 23 in Malaga, Spain. Featuring 39 participating member companies in booth 2126, the demonstration showcases how open interoperability is helping the industry transition next-generation optical networking technologies, from specification to real-world deployment...

OIF Q2 Meeting Advances Management for Path Startup, Encryption, Near-Package Optics and High-Density Connector Interfaces

FREMONT, Calif.--(BUSINESS WIRE)--OIF today announced three new project starts, the release of Common Management Interface Specification (CMIS) 5.4 and approval to publish the Energy Efficient Interfaces (EEI) High-Density (HD) Connector Framework following its Q2 2026 Technical and MA&E Committees Meeting, held May 18–21 in St Julian’s, Malta. The meeting convened more than 175 member company representatives to tackle interoperability needs emerging at the intersection of higher lane rates...
Back to Newsroom