Qnity Showcases Materials Innovation Powering the Next Leap in Electronics at TPCA Show 2026

Driving higher-performance, energy-efficient AI through innovations in advanced packaging, interconnects, and thermal management

TAIPEI, Taiwan--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, will showcase its portfolio at TPCA Show on Oct. 20–22 at the Taipei Nangang Exhibition Center. Through advanced materials and end-to-end solutions, Qnity will demonstrate how its advanced materials are enabling AI through innovations in AI, advanced packaging and interconnects, and thermal management.

"AI is pushing the limits of printed circuit boards — more power, more heat and denser interconnects in more complex designs," said Chuck Xu, President, Interconnect Solutions, Qnity. "Those challenges are solved at the materials level. At TPCA Show and the IMPACT Conference, we'll show how our plating chemistry, circuit imaging, flexible circuit materials and thermal management solutions help customers build AI systems that are faster, more reliable and with improved resource efficiency — and we'll do it the way we always do, working side by side with our customers as a co-innovator."

At the event, Qnity experts will share how its materials innovation enables advanced connectivity and improved thermal efficiency for AI, high-performance computing and data-intensive applications through:

• Oct. 20 – 10:10 a.m. – 12:10 p.m.: A dedicated Qnity session at the IMPACT Conference Taiwan, titled “Enable Energy-Efficient AI Technologies Through Integrated Material Solutions”. The session will explore how integrated material and process innovations can improve the performance, energy efficiency and reliability of next-generation AI systems. Qnity experts will share insights into advanced copper metallization technologies for AI-driven high-density interconnects, as well as thermal management solutions for thin, high-power PCBs used in AI data centers.

• Oct. 21 – 11:10 - 11:25 a.m.: "High-speed AI and Data Center PCB Technology” featuring Qnity R&D leader Jason Chang, outlining advanced metallization solutions for next-generation AI and high-performance computing PCBs.

• Oct. 21 – 1:30 – 3:00 p.m.: "AI-Driven Global Strategy and Market Trends” session, where industry leaders will discuss the evolving AI landscape and its impact on global markets. Chuck Xu, President, Interconnect Solutions, Qnity is honored to participate as one of the forum panelists to dialogue with value chain parters from PCB fabricator and equipment supplier.

Qnity’s commitment to Taiwan is longstanding, with approximately 1,500 team members across technical centers, R&D labs, and manufacturing facilities across the region. Qnity’s products have been powering the next leap in electronics for 50 years.

Customers and partners are invited to connect with Qnity engineers and scientists at Booth L213 on the fourth floor of TaiNEX 1 to explore solutions enabling the next generation of AI technologies.

To learn more about Qnity's activities at TPCA Show and the IMPACT Conference, visit the Qnity Virtual Booth.

About Qnity

Qnity is a premier technology provider across the semiconductor value chain, empowering AI, high performance computing, and advanced connectivity. From groundbreaking solutions for semiconductor chip manufacturing, to enabling high-speed transmission within complex electronic systems, our high-performance materials and integration expertise make tomorrow’s technologies possible. More information about the company, its businesses and solutions can be found at www.qnityelectronics.com.

Qnity™, the Qnity Node Logo, and all products, unless otherwise noted, denoted with ^™ or ^® are trademarks, trade names or registered trademarks of affiliates of Qnity Electronics, Inc.