-

Qnity to Present at the Wolfe Research Materials of the Future Conference

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that Jon Kemp, Qnity’s Chief Executive Officer, will participate in a fireside chat at the Wolfe Research 3rd Annual Materials of the Future Conference on June 16, 2026, at 8:35 a.m. ET.

A live webcast of the fireside chat will be available at Events | Qnity Electronics, Inc. (Q). A replay of the webcast will be available following the conclusion of the event.

About Qnity
Qnity is a premier technology provider across the semiconductor value chain, empowering AI, high performance computing, and advanced connectivity. From groundbreaking solutions for semiconductor chip manufacturing, to enabling high-speed transmission within complex electronic systems, our high-performance materials and integration expertise make tomorrow’s technologies possible. More information about the company, its businesses and solutions can be found at www.qnityelectronics.com.

Qnity™, the Qnity Node Logo, and all products, unless otherwise noted, denoted with TM or ® are trademarks, trade names or registered trademarks of affiliates of Qnity Electronics, Inc.

Contacts

Investor Contact
Meg Miller
Investors@qnityelectronics.com

Media Contact
Ashley Boucher
ashley.boucher@qnityelectronics.com

Qnity Electronics, Inc.

NYSE:Q
Details
Headquarters: Wilmington, Delaware
CEO: Jon Kemp
Employees: 10,000
Organization: PUB

Release Versions

Contacts

Investor Contact
Meg Miller
Investors@qnityelectronics.com

Media Contact
Ashley Boucher
ashley.boucher@qnityelectronics.com

More News From Qnity Electronics, Inc.

Qnity Introduces Stackplane™ CMP Slurry Platform for Advanced Packaging

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, has further expanded its offerings for advanced packaging with the introduction of the Stackplane™ family of slurries for chemical mechanical planarization (CMP). Stackplane™ slurries support the industry's move toward shrink and stack, where continued transistor scaling is paired with the stacking and integration of multiple chips to delive...

Qnity Expands AI-Driven Advanced Packaging Capabilities with End-to-End Process Solutions

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today introduced a scalable materials solution platform that brings together metallization, bumping, dielectric, and fine-line patterning technologies to enable next-generation high-density and 3D integrated semiconductor systems. The platform enables AI-driven advanced packaging, where finer interconnects, higher density, and improved manuf...

Qnity to Present at the Goldman Sachs Communacopia and Technology Conference

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that Jon Kemp, Qnity’s Chief Executive Officer, will have a fireside chat at the 2026 Goldman Sachs Communacopia and Technology Conference on September 10, at 8:10am PST. A live webcast of the presentation will be available at Events | Qnity Electronics, Inc. (Q). A replay of the webcast will be available following the conclu...
Back to Newsroom