-

Qnity Launches Optivision™ Max CMP Pad Family to Enable Next-Generation Semiconductor Manufacturing

Enabling yield and process improvements across advanced nodes and device architectures

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced the expansion of its offerings for chemical mechanical planarization (CMP) with the introduction of Optivision™ Max polishing pads.

As semiconductor devices continue to shrink and increase in complexity, diverse CMP processes are critical to achieving the precision required for reliable device performance. Optivision™ Max CMP pads are designed to help manufacturers maintain tighter control across these increasingly demanding process steps.

“Advanced nodes and evolving device architectures are driving new levels of complexity across semiconductor manufacturing,” said Sanjay Kotha, VP and General Manager of CMP Technologies at Qnity. “Optivision™ Max pads reflect our continued focus on advancing CMP solutions to help customers meet the increasing performance and quality demands of next-generation technologies.”

Building on the Optivision™ CMP pad family, Optivision™ Max offers improved defect control and extended pad lifetime, supporting higher yield and overall process efficiency. Optivision™ Max is Qnity’s newest commercial soft polishing pad, delivering superior performance in critical CMP steps to enhance surface quality, process stability, and reliability for advanced architectures and nodes.

The Optivision™ Max CMP pad family is compatible with a range of CMP applications and can be tailored to meet specific customer requirements. The first commercial offering, Optivision™ Max 8300, is available in all regions for customer sampling and orders in a range of configurations, including integrated windows for endpoint detection. For more information, contact your account representative or visit the Qnity website.

About Qnity

Qnity is a premier technology provider across the semiconductor value chain, empowering AI, high performance computing, and advanced connectivity. From groundbreaking solutions for semiconductor chip manufacturing, to enabling high-speed transmission within complex electronic systems, our high-performance materials and integration expertise make tomorrow’s technologies possible. More information about the company, its businesses and solutions can be found at www.qnityelectronics.com.

Qnity™, the Qnity Node Logo, and all products, unless otherwise noted, denoted with ™ or ® are trademarks, trade names or registered trademarks of affiliates of Qnity Electronics, Inc.

Contacts

Media Contact
Ashley Boucher
ashley.boucher@qnityelectronics.com

Qnity Electronics, Inc.

NYSE:Q
Details
Headquarters: Wilmington, Delaware
CEO: Jon Kemp
Employees: 10,000
Organization: PUB

Release Versions

Contacts

Media Contact
Ashley Boucher
ashley.boucher@qnityelectronics.com

More News From Qnity Electronics, Inc.

Qnity Introduces Stackplane™ CMP Slurry Platform for Advanced Packaging

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, has further expanded its offerings for advanced packaging with the introduction of the Stackplane™ family of slurries for chemical mechanical planarization (CMP). Stackplane™ slurries support the industry's move toward shrink and stack, where continued transistor scaling is paired with the stacking and integration of multiple chips to delive...

Qnity Expands AI-Driven Advanced Packaging Capabilities with End-to-End Process Solutions

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today introduced a scalable materials solution platform that brings together metallization, bumping, dielectric, and fine-line patterning technologies to enable next-generation high-density and 3D integrated semiconductor systems. The platform enables AI-driven advanced packaging, where finer interconnects, higher density, and improved manuf...

Qnity to Present at the Goldman Sachs Communacopia and Technology Conference

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that Jon Kemp, Qnity’s Chief Executive Officer, will have a fireside chat at the 2026 Goldman Sachs Communacopia and Technology Conference on September 10, at 8:10am PST. A live webcast of the presentation will be available at Events | Qnity Electronics, Inc. (Q). A replay of the webcast will be available following the conclu...
Back to Newsroom