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Si2 Compact Model Coalition Announces 2026 International Compact Modeling Conference

Save the Date and Submit Your Research – Final Paper Deadline Extended!

LONG BEACH, Calif.--(BUSINESS WIRE)--The Si2 Compact Model Coalition, IEEE, and IEEE EDS are sponsoring the second edition of the International Compact Modeling Conference (ICMC), a two-day in-person event bringing together global experts in design, process technology, and model development to discuss advancements in semiconductor device modeling.

The conference will be held from July 30-31, 2026 at the Queen Mary in Long Beach, California.

Corporate Sponsors: Cadence | Keysight | Micron | Qualcomm | Sandia National Laboratories | Siemens |Synopsys |TSMC

Media Sponsors: SemiWilki | Semiconductor Digest

Researchers and practitioners are invited to contribute to the evolution of device models through oral and poster presentations in the following highlighted themes:

  • Electrostatic Discharge (ESD) modeling for protection design
  • Reliability and aging-aware compact models and simulation techniques
  • AI or Machine Learning for model development, parameter extraction, circuit simulation efficiency, etc.

Submissions are also accepted in the following areas:

  • Application of Device Models
  • Device Model Development
  • Model Enhancements and Implementations
  • Emerging Devices

The paper submission deadline has been extended to March 2, 2026.

To learn more or to submit your research, please visit https://2026.si2-icmc.org.

Visit ICMC on social media

LinkedIn

About Si2

The Silicon Integration Initiative Inc. is a global, not-for-profit membership organization with approximately 70 corporate members who collaborate on trusted standards and shared solutions that reduce development costs and increase design productivity for semiconductor foundries, fabless design companies, and EDA software providers. Learn more at https://si2.org/.

About IEEE

IEEE is the world's largest technical professional organization dedicated to advancing technology for the benefit of humanity. Learn more at https://www.ieee.org/.

About IEEE EDS

EDS fosters the professional growth of its members by satisfying their needs for easy access to and exchange of technical information, publishing, education, and technical recognition and enhancing public visibility in the field of Electron Devices. Learn more at https://eds.ieee.org/.

Contacts

Media Contact – Leigh Anne Clevenger, (737) 212-4572, leighanne.clevenger@si2.org

Si2


Release Summary
Si2, IEEE, and IEEE EDS are sponsoring the second edition of the International Compact Modeling Conference (ICMC). Paper deadline extended to March 2
Release Versions

Contacts

Media Contact – Leigh Anne Clevenger, (737) 212-4572, leighanne.clevenger@si2.org

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