-

JEDEC’s SOCAMM2: Low Power Compact LPDDR5X Modules Poised to Power Next-Gen AI Servers

ARLINGTON, Va.--(BUSINESS WIRE)--JEDEC® Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is nearing completion of JESD328: LPDDR5/5X Small Outline Compression Attached Memory Module (SOCAMM2) Common Standard, an upcoming standard for low-profile LPDRAM modules developed specifically for data center AI applications. When published, JESD328 is designed to provide a memory platform that delivers modular, low-power, high-bandwidth memory for AI CPU servers and accelerated computing platforms. JESD328 will define a compact, serviceable LPDDR5X-based module, Small Outline CAMM2 (SOCAMM2).

JESD328 SOCAMM2 is set to introduce an optimized, compact form factor for servers with a mechanical outline designed for high-density data center chassis and board layouts, with scalability to provide a path to support the large module capacities required by AI training and inference servers.

To support the high-performance demands of these data center applications, the standard is forecast to support the full LPDDR5X data rate, including configurations up to 9.6 Gb/s per pin where platform signal integrity allows. The use of low power LPDDR5/5X memory devices reduces system energy and cooling requirements, a key feature in efficient large data processing.

As planned, SOCAMM2 will introduce a Serial Presence Detect (SPD) configuration device supporting module-level identification and telemetry, with qualification flows designed to meet stringent field‑reliability targets required in enterprise deployments.

Stay tuned for more updates and details when SOCAMM2 is published. For access to pre-publication proposals and early insights into active projects such as SOCAMM2, consider joining JEDEC as a member company. Discover the benefits of membership and join today.

“JEDEC members are actively shaping the standards that will define next generation modules for use in AI data centers, driving the future of innovation in infrastructure and performance,” said Mian Quddus, Chairman of the JEDEC Board of Directors and the JC-45 Committee for DRAM Modules.

JEDEC standards are subject to change during and after the development process, including disapproval by the JEDEC Board of Directors.

About JEDEC

JEDEC is the global leader in the development of standards for the microelectronics industry. Thousands of volunteers representing over 380 member companies work together in more than 100 JEDEC committees and task groups to meet the needs of every segment of the industry, for manufacturers and consumers alike. The publications and standards generated by JEDEC committees are accepted throughout the world. All JEDEC standards are available for download from the JEDEC website. For more information, visit https://www.jedec.org.

Contacts

Emily Desjardins
703-907-7560
emilyd@jedec.org

JEDEC Solid State Technology Association


Release Versions

Contacts

Emily Desjardins
703-907-7560
emilyd@jedec.org

More News From JEDEC Solid State Technology Association

JEDEC® Announces Automotive Electronics Forum in September 2026

ARLINGTON, Va.--(BUSINESS WIRE)--JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced that it is hosting an Automotive Electronics Forum on September 17, 2026 in Santa Clara, CA. Advance registration is required and space is limited. For more information and registration, visit the JEDEC website. Join industry leaders for a forward-looking program focused on the biggest challenges and opportunities shaping...

JEDEC® Chairman Mian Quddus to Receive 2026 FMS Lifetime Achievement Award

ARLINGTON, Va.--(BUSINESS WIRE)--JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, congratulates its longtime Chairman Mian Quddus on being chosen to receive the 2026 FMS Lifetime Achievement Award. The award will be presented to Mr. Quddus at the FMS event in Santa Clara, California on Tuesday August 4, 2026 at 3:20PM in the Mission City Ballroom, in recognition of his sustained leadership in industry standards organizations...

New JEDEC® SPHBM4 Standard Enables HBM4-Class Bandwidth on Organic Substrates

ARLINGTON, Va.--(BUSINESS WIRE)--JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD330-4: Standard Package High Bandwidth Memory (SPHBM4). SPHBM4 uses the same DRAM dies as HBM4, commonly used in artificial intelligence accelerators, with a new interface base die that enables mounting on standard organic substrates rather than silicon substrates. JESD330-4 is available for download from...
Back to Newsroom