Marki Microwave Introduces High Frequency, Ultra-Small Form Factor Chip Scale Packaging Platform

New Lineup of Equalizers and Attenuators Delivers Die-Level Performance in a Surface Mount Package

MORGAN HILL, Calif.--()--Marki Microwave, innovator in the radio frequency and microwave industry for over 30 years, today introduced a family of GaAs monolithic microwave integrated circuit (MMIC)-based equalizers and attenuators, designed using the company’s new patent pending chip scale packaging (CSP) platform. Featuring very high frequency operation in an ultra-small form factor, the industry leading packaging capability can be reflowed onto customer boards using standard surface mount assembly processes.

For many years, Marki Microwave has been on a quest to develop the industry’s highest possible frequency surface mount package,” said Christopher Marki, CEO of Marki Microwave. “The CSP family of attenuators and equalizers is the next iteration in the company’s portfolio of performance shattering technology. This innovative packaging approach makes each product capable of delivering high frequency operation together with the smallest form factor.”

Marki’s Microwave’s new CSP technology enables high frequency operation, improved electrical performance, low unit-to-unit variation and consistency while optimizing size, weight, power and cost (SWaP-C). Moreover, the technology allows for extreme miniaturization of the surface mount footprint while providing superior return loss in an ultra-compact form. Unlike traditional packaging currently available on the market, Marki Microwave’s unique approach to CSP technology for GaAs MMIC products can be leveraged across all of Marki’s product categories, enabling die-like size and performance with the ease of use of a surface mount product.

Chip Scale Packaged MMIC Equalizers Bolster Low Pass Filtering Effects in Radio Frequency and High-Speed Digital Systems

Built for superior GaAs MMIC performance, the MEQ6-26CSP1 and MEQ10-45CSP1 are the newest additions to Marki Microwave’s robust portfolio of surface mount and bare die equalizers. Building on the leading-edge technology of their predecessors, the products’ compact 1.5 x 1.5 mm footprint is bolstered using Marki Microwave’s CSP platform.

The MEQ6-26CSP1 is a passive MMIC equalizer with a positive gain slope from DC to 26GHz and typical insertion loss of 0.3dB at 26GHz. Featuring a DC attenuation of 6dB, it provides consistent unit-to-unit repeatability in a small form factor, making it an ideal solution when compensating for low pass filtering effects in microwave and high-speed digital systems.

Second in the lineup, the MEQ10-45CSP1 has a positive gain slope from DC to 45GHz with a DC attenuation of 10dB. It provides a typical insertion loss of 0.7dB at 45GHz and a voltage standing wave ratio (VSWR) of 1.5 over the entire band. The MEQ10-45CSP1 is suitable for a variety of high performance applications, including high-speed data, telecom and amplifier compensation.

10dB Attenuator Enables Precision-Grade Accuracy and Radio Frequency Power for Demanding Applications

As the third member of Marki Microwave’s CSP family, the ATN10-0050CSP1 is a precision surface mount GaAs MMIC attenuator that delivers 10dB attenuation from DC to 50 GHz and an excellent 22dB typical return loss over band. A 50-ohm match is maintained over the entire operating frequency range and its 1.5 x 1.5 mm package streamlines the design of space-constrained applications like airborne, SWaP-C and high channel count systems.

Availability and Pricing

Estimated availability for the MEQ6-26CSP1, MEQ10-45CSP1 and ATN10-0050CSP1 is the beginning of May 2022. Low volume pricing begins at $36.38 for equalizers and $21.54 for the attenuator. Pricing and specifications subject to change without notice. For samples and sales information, contact

About Marki Microwave

At Marki Microwave, our goal is to invent technologies that empower the RF and microwave industry to design faster, simplify production, eliminate complexity and shatter performance barriers. All our products are designed and developed in the United States with a specialized team and state of the art testing and CAD simulation software. Our approach is to collaborate with our customers and suppliers to achieve the breakthroughs needed for today's ever-increasing demands of electronic products. All assembly and tests are performed under the supervision of the design engineer at the same facility. Our assembly capabilities include precision leaded and lead-free solder and wire bonding for gold/thin film assembly. Our portfolio of high-performance components include broadband, low conversion loss, and highly linear mixers, high directivity, low return loss couplers and directional bridges, well balanced power dividers and hybrid couplers, and many other quality products. To view our comprehensive catalog, visit our website at For specific details, please call us at 408.778.4200 or email

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Olivia Metcalfe
Marki Microwave


Olivia Metcalfe
Marki Microwave