-

Teledyne e2v HiRel and Integra Technologies Inc. Partner on High Voltage GaN Devices

New partnership brings Integra’s high performance GaN to high reliability markets, including products for LEO/GEO applications

MILPITAS, Calif.--(BUSINESS WIRE)--Teledyne e2v HiRel Electronics, a leading provider of high reliability semiconductor solutions, today announced a new high reliability partnership with California-based Integra Technologies, Inc. (Integra). Under the new agreement, Teledyne will leverage Integra’s portfolio of GaN on SiC RF power transistor products to deliver optimized power solutions for the space market.

With Integra, Teledyne e2v HiRel will specialize in providing high power RF devices for emerging space applications in the LEO and GEO payload market. Teledyne will also offer high reliability options for Integra's popular GaN on SiC power devices and pallets targeted at the defense market.

“Our space customers are requesting RF power devices at higher power density levels and operating at higher frequencies,” said Brad Little, VP and General Manager of Teledyne e2v HiRel. “The combination of our expertise in providing space RF components along with Integra’s high performance RF GaN device technology and product portfolio will provide space payload engineers state-of-the-art power devices for insertion in their applications.”

"Integra has decades of proven success enabling a variety of defense and commercial radar systems with our world class RF power products,” said Suja Ramnath, CEO of Integra. “We are excited to partner with Teledyne e2V, a market leader in hi-rel with deep domain expertise, to extend the application of our unique GaN on SiC technology and products into the growing space market."

ABOUT TELEDYNE E2V HIREL ELECTRONICS

Teledyne e2v HiRel innovations lead developments in space, transportation, defense, and industrial markets. Teledyne e2v’s unique approach involves listening to the market and to the application challenges of customers and partnering with our customers to provide innovative standard, semi-custom or fully custom solutions, bringing increased value to their systems. Teledyne e2v HiRel Electronics is part of the Teledyne Defense Electronics Group. www.tdehirel.com

ABOUT INTEGRA TECHNOLOGIES, INC.

Founded in 1997, Integra is a leading innovator of RF and Microwave high power semiconductor and pallet solutions for mission-critical applications, including state-of-the-art radar, electronic warfare, and advanced communications systems. www.integratech.com.

Contacts

Media Contact:
Darrek Porter, Director of Marketing
Teledyne Defense Electronics
(404)-368-9714
darrek.porter@teledyne.com

Teledyne e2v HiRel Electronics LogoTeledyne e2v HiRel Electronics Logo

Teledyne e2v HiRel Electronics


Release Summary
Teledyne e2v HiRel partners with Integra Technologies to bring GaN to emerging hi-rel applications in Space for the LEO and GEO markets.
Release Versions

Contacts

Media Contact:
Darrek Porter, Director of Marketing
Teledyne Defense Electronics
(404)-368-9714
darrek.porter@teledyne.com

More News From Teledyne e2v HiRel Electronics

Teledyne Labtech Leads Groundbreaking Welsh Space Cooling Project with Bangor University

PRESTEIGNE, Wales--(BUSINESS WIRE)--Teledyne Labtech, a leading innovator in advanced electronic PCB solutions is spearheading a pioneering Welsh disruptive technology that could revolutionize thermal management in space electronics. The project, titled Advanced Thermal Management for Space Electronics (ATMS), is a collaborative effort between Teledyne Labtech and Bangor University in Wales, supported by Airbus Endeavr - a joint initiative between Airbus and the Welsh Government. Its goal is to...

Teledyne HiRel Semiconductors Launches eMMC 5.1 Module

MILPITAS, Calif.--(BUSINESS WIRE)--Teledyne HiRel Semiconductors is pleased to announce the release of their industrial-grade embedded MultiMediaCard (eMMC) module. Featuring 128GB of eMMC 5.1-compliant storage in a compact 153-ball FBGA package, this device is engineered to deliver reliable, high-speed performance in harsh environments. Qualified over the industrial temperature range of –40°C to +85°C, this eMMC module is well-suited for embedded applications in aerospace, defense, industrial...

Teledyne HiRel Semiconductors Announces High-Density 16 GByte DDR4 Module

MILPITAS, Calif.--(BUSINESS WIRE)--Teledyne HiRel Semiconductors, a leader in ruggedized semiconductors for mission-critical environments, today announced the release of the TDD416Y12NEPBM01, a compact DDR4 memory module, screened and qualified as an Enhanced Product (EP) and rated for operation from –40°C to +105°C. The TDD416Y12NEPBM01, is a compact, solder-down DDR4-3200 memory solution that delivers high bandwidth in a dramatically reduced footprint – smaller than a postage stamp. Packaged...
Back to Newsroom