BISTelligence China 2020 Virtual Event Opens for Registration

Virtual Event Features Latest Semiconductor and FPD Manufacturing AI, Cloud, and Edge technologies

SHENZHEN, China--(BUSINESS WIRE)--BISTel, the world leader in semiconductor engineering equipment systems and AI applications for semiconductor and flat panel display smart manufacturing announced today that registration for BISTelligence CHINA 2020 is now open. BISTelligence China 2020 is a virtual, year-round tradeshow room dedicated to providing China’s semiconductor engineers access to the latest AI, cloud and edge automation technologies for smarter manufacturing. With all of the world’s tradeshows cancelled in 2020 and uncertainty over their status for 2021, BISTel is providing this new platform as a forum to share the latest advances in AI for semiconductor smart manufacturing with a steady stream of technical and business content that informs and engages China’s engineering communities across the semiconductor, flat panel manufacturing and electronics manufacturing sectors.

BISTelligence CHINA 2020 open for FREE registration

BISTelligence CHINA 2020 features five core tracks. These include:

1) Real-time monitoring and anomaly detection. Test the industry’s leading real-time detection solutions, including the semiconductor manufacturing industry’s number one FDC system.

2) Trace analytics. BISTel features new demos of the updated eDatalyzer®, a suite of machine learning based root cause analysis applications that quickly solves yield issues in semiconductor production.

3) Test AI applications including GrandView APM, an Asset Performance Management system that monitors the health of critical assets and offers predictive analytics that identifies production problems before they occur. It even provides a remaining useful life (RUL) prediction of equipment.

4) Cloud. Introduction of the Chinese semiconductor industry's next-generation, Cloud based dynamic fault detection (DFD) application that removes costly infrastructure and deployment costs, offering semiconductor manufacturers a high performance advanced FDC at fraction of the cost.

5) Edge. BISTel showcases the first Edge devices for semiconductor packaging and assembly wire bonding applications that smash infrastructure costs and improve machine performance. Come see how these solutions are already being deployed in Taiwan.

Celebrate the Next 20 Years

Fabs of the Future – As BISTel celebrates its 20^th Anniversary, we look back on the first semiconductor EES solutions we pioneered in 2001 and how they empowered engineers and shaped the industry. Besides interactive presentations, BISTelligence CHINA 2020 offers FREE access and FREE downloads of all technical content. There will also be an opportunity for live demos and to schedule time with industry experts and analysts to better understand these new advancements in factory operations and equipment performance.

“We are excited to bring the BISTelligence franchise to China to support semiconductor and FPD manufacturing by introducing new technology innovation and advancements,” noted W.K.Choi, CEO, BISTel. “Customer engagement in COVID-19 times presents challenges that BISTelligence China 2020 will try to overcome. Using the digital world to fill the gaps in customer knowledge, we will help our engineering community stay informed with the latest advancements in manufacturing AI.”

How to Register and Enjoy Access to Free Grand Prizes

Click the link to BISTelligence 2020 and register for FREE. When registered, attendees will have access to exclusive content on the latest innovations in AI, Cloud, Edge and IoT. Registration opens November 1 with BISTelligence China 2020 starting November 16, 2020 through November 30, 2020. Besides the virtual showroom, BISTelligence China 2020 offers a grand prize to be announced November 30 and daily prize drawings.

About BISTel

BISTel is the world’s leading supplier of engineer equipment systems (EES) and intelligent manufacturing A.I. applications. To learn more visit https://www.bistel.com.