xMEMS Enters Mass Production of Solid-State Micro-Cooling Expanding Active Thermal Management Across Edge AI and Data Center Infrastructure

• Marks the first large-scale commercialization of solid-state active cooling for Edge AI
• Extends xMEMS’ thermal management platform across AI glasses, AI smartphones and data center infrastructure
• First commercial products featuring XMC-2400 expected to reach market in early 2027

SANTA CLARA, Calif.--(BUSINESS WIRE)--xMEMS Labs, Inc., the pioneer of the world's first solid-state MEMS speakers and breakthrough μCooling^® fan-on-a-chip technology, today announced the start of mass production of its XMC-2400 and XMC-4800 µCooling chips.

The ultra-compact solid-state cooling devices combine high back pressure, silent operation, and semiconductor reliability in a form factor small enough for AI glasses, AI smartphones, and other Edge AI systems, while also enabling targeted thermal management for data center infrastructure. The milestone marks the first large-scale commercialization of solid-state active cooling and expands semiconductor-based thermal management across the AI hardware ecosystem. At CES 2027, xMEMS will demonstrate how µCooling is addressing thermal challenges from AI glasses and smartphones to data center infrastructure in The Venetian, Suite #34-208.

The move to commercial-scale production brings xMEMS’ µCooling platform to two rapidly growing AI markets. XMC-2400 is engineered for compact Edge AI products including AI and XR glasses, and personal SSDs, while XMC-4800 delivers higher airflow for thermally demanding AI smartphones and data center applications, including enterprise SSDs and other lower-power subsystems. The first commercial products featuring XMC-2400 are expected to reach the market in early 2027.

“Edge AI systems are creating thermal requirements that conventional cooling technologies cannot address,” said Mike Housholder, Vice President and General Manager of the Thermal Management Business Unit at xMEMS Labs, Inc. “AI glasses and AI smartphones need active heat removal in an extremely small form factor where conventional fans simply cannot fit, while zero noise, vibration and high reliability remain critical design requirements.”

Continued Housholder, “With their ultra-compact size, high back pressure and silent solid-state operation, XMC-2400 and XMC-4800 provide a unique active cooling solution for these next-generation Edge AI devices. As we enter mass production, xMEMS is ready to support growing customer demand at scale, while our monolithic silicon architecture creates a future path toward co-packaged thermal solutions alongside increasingly powerful Edge AI processors.”

Across both markets, rising power density is making thermal management increasingly central to sustained AI performance. Edge devices are integrating more on-device AI, computer vision and multimodal processing into thin, mobile form factors. In AI data centers, liquid cooling is increasingly concentrated around high-power CPUs and GPUs, while SSDs, laser modules, memory, retimers and other critical subsystems benefit from precisely targeted active airflow.

xMEMS µCooling addresses these thermal requirements through the company’s piezoMEMS semiconductor platform. Its all-silicon MEMS architecture generates controlled, high-pressure airflow with no rotating blades or bearings, enabling silent, vibration-free active cooling that can be directed through narrow micro-channels and positioned close to processors, memory, storage and other thermal hotspots.

The XMC-2400 measures just 7.42 x 9.48 x 1.13 millimeters and delivers up to 28 cubic centimeters of airflow per second at up to 1,300 Pa of back pressure while consuming approximately 150mW. The XMC-4800 measures 9.93 x 14.35 x 1.13 millimeters and delivers up to 48 cubic centimeters of airflow per second at up to 1,100 Pa of back pressure while consuming approximately 240mW. In real-world testing, µCooling customers have achieved chip and system-level temperature reductions between 10 to 25°C across glasses, smartphone and SSD devices.

Together, XMC-2400 and XMC-4800, along with the recently introduced XMC-1200, engineered for AR/ XR light engines, processors, and other components in smart glasses, extend xMEMS active thermal management across the AI hardware stack, from wearable devices measured in grams to data center infrastructure measured in racks.

For more information about xMEMS and its µCooling solutions, visit xmems.com. For high-resolution, click here.

About xMEMS Labs

xMEMS Labs, Inc. is advancing the foundation of AI hardware by eliminating longstanding constraints in thermal and audio design. Its proprietary piezoMEMS platform enables a portfolio of thin and light solid-state speakers and µCooling solutions that deliver silent, reliable, chip-level performance for increasingly compact and powerful devices, including SSDs, smartphones, AI glasses, and AR/XR systems. Based in Santa Clara, California, xMEMS is enabling sustained performance in the next era of AI computing. Visit xmems.com.