TeraSignal Delivers Industry’s First Intelligent Redriver for 200G+ Copper Interconnects

Breakthrough CMOS device built on TeraSignal’s TSAFE™ analog front-end architecture integrates CMIS-based link training with Advanced Equalization to dramatically improve link margin, reach, and reliability in AI Scale-Up Networks

LOS ANGELES--(BUSINESS WIRE)--OFC 2026 – TeraSignal, a leader in intelligent interconnect technology today announced the TeraSignal TS5802, the world’s most advanced analog equalizer, implemented in advanced CMOS technology and engineered to extend reach and increase link margin for 200G and higher-speed interconnects. The TS5802 is built on TeraSignal’s proprietary TSAFE™ (TeraSignal Analog Front-End) technology, which tightly integrates the critical high-speed analog building blocks required for next-generation linear interconnects in AI scale up networks.

In addition, the TeraSignal TS5802 utilizes TeraSignal’s TSLink™ technology to perform CMIS (Common Management Interface Specification) based link training and monitoring, enabling intelligent, adaptive operation that automatically optimizes link performance across a wide range of channel conditions. Link training allows the device to automatically configure its equalization and operating parameters for a given link, while link monitoring provides real-time telemetry needed to detect degradation and prevent failures before they impact system performance.

As data rates accelerate toward 200G, 400G, and beyond, traditional analog equalization approaches based on CTLE (Continuous Time Linear Equalizer) are increasingly strained by channel loss, crosstalk, and noise. TSAFE addresses these challenges through a tightly integrated analog architecture that combines a low-noise linear amplifier, CTLE, FFE (Feed Forward Equalizer), and linear output driver into a single optimized signal path. By combining both CTLE and FFE functions, TS5802 is the first analog equalizer in the industry that is able to reduce both pre-cursor and post cursor ISI (inter-symbol interference) terms, resulting in longer reach and improved reliability for demanding 200G+ applications. Implemented in CMOS, the TS5802 delivers this level of performance while enabling high levels of integration, scalability, and cost efficiency.

“TS5802 represents a major leap in analog signal conditioning for high-speed linear interconnects,” said Dr. Armond Hairapetian, CEO at TeraSignal. “By integrating TSAFE and CMIS-based link training into a single CMOS device, we enable system designers to achieve significantly higher link margin, lower bit error rates, and reliable operation at 200G and above.”

The TS5802 is optimized for next-generation AI accelerators, hyperscale data center switches, network interface cards, optical modules, and active copper cables, as well as emerging architectures including Active Copper Cables (ACC), Near-Packaged Optics (NPO), Co-Package Optics, Linear Pluggable Optics (LPO) and Linear Receive Optics (LRO).

Its advanced equalization, linear output capability, and intelligent link training and diagnostics allow designers to compensate for severe channel impairments while maintaining excellent linearity and low noise, making it ideal for PAM4-based links and other multi-level modulation schemes.

Key Benefits of the TeraSignal TS5802 Intelligent Redriver:

• Extends reach and improves signal integrity for 200G+ electrical interconnects
• Industry-leading link margin improvement for 200G+ linear channels
• CMOS implementation for high integration, scalability, and cost efficiency
• TSAFE technology integrating low-noise linear amplifier, CTLE, FFE, and linear output driver
• TSLink technology for automatic link training and real-time link monitoring
• Supports ACC, NPO, CPO, LPO and LRO architectures
• Optimized for PAM4 and high-speed serial interfaces
• Enables longer reach, lower BER, and improved system robustness
• Simplifies board design and reduces overall power and cost

The TS5802 reinforces TeraSignal’s leadership in intelligent interconnect technology for next-generation AI and cloud infrastructure.

Availability

Samples of the TeraSignal TS5802 are available now, with production availability planned for Q3 2026. For more information about the TS5802 and TSAFE technology, visit www.terasignal.com.

About TeraSignal

TeraSignal is a leader in high-speed data transmission, specializing in intelligent interconnect solutions for AI Infrastructure, and next generation computing hardware, and Linear Optics. Our technologies and products focus on improving power efficiency, reducing latency, and lowering bit-error-rate, while providing advanced link diagnostics in optical interconnects. Through innovations in CMOS design and adaptive link training, TeraSignal is redefining intelligent optical connectivity across various components in AI infrastructure. Learn more at terasignal.com.

TeraSignal, TSLink, TSAFE are among the trademarks of TeraSignal. Other trademarks are the property of their respective owners.