-

Qnity Announces $61.5 Million Investment in New Advanced Semiconductor Research & Manufacturing Facility

Expansion strengthens local-for-local footprint and accelerates capacity to meet growing advanced-node and advanced packaging demand

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q) today announced the acquisition of a new facility in Taiwan, to accelerate capacity and support continued customer demand across the global semiconductor industry. The $61.5 million advanced semiconductor research and manufacturing facility marks a significant investment in Qnity’s growth to keep pace with customer demand.

The new facility will support the production of the most advanced chip manufacturing applications. The site will feature production areas, state-of-the-art clean rooms, warehousing infrastructure, research labs and dedicated office space designed to enable high-performance manufacturing at scale.

This site expands Qnity’s existing presence in the Hsinchu Science Park, and the new facility strengthens the company's commitment to maintaining manufacturing sites near customers in key geographies. With a global footprint and a strategic local-for-local operating model, Qnity enables customers and partners to meet rising demand from AI, high-performance computing, and advanced connectivity.

“Growth in advanced-node manufacturing continues to accelerate, and our customers are scaling rapidly to support next-generation technologies,” said Jon Kemp, Chief Executive Officer at Qnity. “This investment expands our capacity to meet customer demand, enhances global supply chain resilience, and enables the innovation and performance our customers depend on.”

The global semiconductor industry is expecting to reach $1 trillion in revenues in the next few years, driven by the rapidly increasing demand for AI chips and data centers. Over the past three years, Qnity has added new capacity across its semiconductor businesses to keep pace with industry expansion. The investment to expand this capacity in Taiwan builds on that momentum while reinforcing the company’s long-term growth strategy.

By increasing production capabilities in proximity to key customers, Qnity is strengthening supply assurance, improving operational agility, and positioning itself to meet the evolving demands of next-generation chip manufacturing.

“This facility represents more than just additional capacity; it reflects our confidence in the industry’s trajectory and our commitment to ensure customer support across current and future growth cycles,” added Kemp. “We are building the infrastructure today to make tomorrow’s semiconductor innovations possible.”

The site is expected to begin operations in early 2027, with additional capabilities and research facilities in future development phases.

About Qnity
Qnity is a premier technology provider across the semiconductor value chain, empowering AI, high performance computing, and advanced connectivity. From groundbreaking solutions for semiconductor chip manufacturing, to enabling high-speed transmission within complex electronic systems, our high-performance materials and integration expertise make tomorrow’s technologies possible. More information about the company, its businesses and solutions can be found at www.qnityelectronics.com.

Qnity™, the Qnity Node Logo, and all products, unless otherwise noted, denoted with TM or ® are trademarks, trade names or registered trademarks of affiliates of Qnity Electronics, Inc.

Contacts

Qnity Media Contact
Ashley Boucher
ashley.boucher@qnityelectronics.com

Qnity Electronics, Inc.

NYSE:Q
Details
Headquarters: Wilmington, Delaware
CEO: Jon Kemp
Employees: 10,000
Organization: PUB

Release Versions

Contacts

Qnity Media Contact
Ashley Boucher
ashley.boucher@qnityelectronics.com

More News From Qnity Electronics, Inc.

Qnity Introduces Stackplane™ CMP Slurry Platform for Advanced Packaging

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, has further expanded its offerings for advanced packaging with the introduction of the Stackplane™ family of slurries for chemical mechanical planarization (CMP). Stackplane™ slurries support the industry's move toward shrink and stack, where continued transistor scaling is paired with the stacking and integration of multiple chips to delive...

Qnity Expands AI-Driven Advanced Packaging Capabilities with End-to-End Process Solutions

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today introduced a scalable materials solution platform that brings together metallization, bumping, dielectric, and fine-line patterning technologies to enable next-generation high-density and 3D integrated semiconductor systems. The platform enables AI-driven advanced packaging, where finer interconnects, higher density, and improved manuf...

Qnity to Present at the Goldman Sachs Communacopia and Technology Conference

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that Jon Kemp, Qnity’s Chief Executive Officer, will have a fireside chat at the 2026 Goldman Sachs Communacopia and Technology Conference on September 10, at 8:10am PST. A live webcast of the presentation will be available at Events | Qnity Electronics, Inc. (Q). A replay of the webcast will be available following the conclu...
Back to Newsroom