-

Teledyne MEMS Welcomes Strategic Investment in C2MI

BROMONT, Quebec--(BUSINESS WIRE)--Teledyne Technologies Incorporated (NYSE:TDY) (“Teledyne”) announced today that Teledyne MEMS, a founding member and partner of the MiQro Innovation Collaborative Center (C2MI), is proud to acknowledge the Canadian and Quebec governments’ strategic investment in its expansion into the next project phase, C2MI1.5. The C$656 million investment announced today marks a milestone in strengthening Canada’s semiconductor and microelectronics ecosystem.

The funding will enable C2MI to enhance its infrastructure and capabilities, particularly in support of advanced packaging and post-processing technologies. Teledyne MEMS, a C2MI partner since 2011, views this initiative as a critical enabler for innovation and growth. Over 14 years of collaboration, Teledyne MEMS has contributed to creating 120 jobs and completing more than 30 customer projects in the partnership, spanning applications from inertial sensors and timing devices to optical MEMS, MEMS photonics, microbolometers, and BioMEMS.

“This investment in C2MI directly supports our ability to perform advanced post-CMOS processing on 200mm and 300mm wafers,” said Sébastien Michel, Vice President and General Manager, Teledyne MEMS. “It strengthens our collaboration with academic and industrial partners, enables the development of next-generation imaging sensors and other products, while accelerating innovation in photonics, MEMS, and sensor technologies.”

Teledyne MEMS remains committed to advancing microfabrication excellence and contributing to the resilience and competitiveness of North America’s semiconductor supply chain.

About Teledyne

Teledyne is a leading provider of sophisticated digital imaging products and software, instrumentation, aerospace and defense electronics, and engineered systems. Teledyne’s operations are primarily located in the United States, Canada, the United Kingdom, and Western and Northern Europe. For more information, visit Teledyne’s website at www.teledyne.com.

Contacts

Sébastien Michel
(450) 577-6153

Teledyne Technologies Incorporated

NYSE:TDY

Release Versions

Contacts

Sébastien Michel
(450) 577-6153

More News From Teledyne Technologies Incorporated

Aitech’s SP1 SpaceVPX SBC Showcases Strategic Integration of Teledyne’s Advanced Space Computing Capabilities

CHATSWORTH, Calif. & GRENOBLE, France--(BUSINESS WIRE)--Aitech and Teledyne e2v Semiconductors are proud to highlight their continued collaboration in advancing space-grade computing. Through their ongoing partnership, Teledyne e2v’s high-reliability semiconductors are being integrated into Aitech’s SP1, a radiation-tolerant 3U SpaceVPX single-board computer (SBC). Designed for deployment in LEO, GEO, lunar, and deep space missions, the SP1 is a robust computing platform tailored for spacecraft...

Teledyne to Participate at the TD Cowen Aerospace & Defense Conference

THOUSAND OAKS, Calif.--(BUSINESS WIRE)--Teledyne Technologies Incorporated (NYSE:TDY) today announced that George Bobb, President and Chief Executive Officer, and Jason VanWees, Vice Chairman, will present at the TD Cowen 47th Annual Aerospace & Defense Conference at the Ritz-Carlton – Pentagon City in Arlington, Virginia on Thursday, February 12, at 11:30 a.m. Eastern Time. A live webcast of Teledyne’s presentation may be accessed via the company’s website at www.teledyne.com/investors/eve...

Teledyne FLIR OEM Advances State of the Art in Infrared Imaging

THOUSAND OAKS, Calif.--(BUSINESS WIRE)--Teledyne Technologies Incorporated (NYSE:TDY) today recognized the agile performance, innovation, and production scale of its business unit, Teledyne FLIR OEM. As the global leader in intelligent thermal imaging systems, Teledyne FLIR OEM operates as a commercial foundry with unmatched vertical integration. Serving defense primes, industrial customers, and commercial markets with the speed and flexibility of a non-traditional defense contractor, the compa...
Back to Newsroom