Chiplet Summit Announces a New Awards Program for Technology Breakthroughs

The awards spotlight application acceleration, packaging, die-to-die interfaces, and other key technical areas.

SANTA CLARA, Calif.--(BUSINESS WIRE)--Chiplet Summit, the premier global event focused on chiplet-based design and integration, will debut its Best of Show Awards at the 2026 event, taking place February 17-19, 2026, at the Santa Clara Convention Center in Santa Clara, CA. The awards celebrate the innovators and technologies driving higher chip performance.

The Best of Show Awards cover three key categories:

• AI Accelerators – Next-generation compute engines that increase AI/ML performance.
• Packaging and Substrates – Advances in package design, substrates, power and thermal management, and manufacturing methods that improve performance, density, and cost-effectiveness.
• Connectivity and Interoperability – Standards-based or proprietary advances that enable seamless communications across multi-die, multi-vendor systems.

An independent panel of industry experts and thought leaders will judge entries based on innovation, technical merit, and potential industry impact. Products are eligible only if developers are sponsors or exhibitors at Chiplet Summit 2026.

“Chiplets are reshaping chip performance, efficiency, and innovation,” said Chuck Sobey, General Chair, Chiplet Summit. “The Best of Show Awards spotlight new solutions and pioneers who are shaping the future of AI computing.”

Winners will be announced live during Chiplet Summit 2026. Details on submitting nominations and judging are available at: https://chipletsummit.com/2026-best-of-show-awards/

About Chiplet Summit

Chiplet Summit, a product of Semper Technologies, is a technical conference and trade show that showcases the emerging chiplet market. The event features the innovators and companies using chiplets in designs for processors, memories, communications chips, and AI devices. For more information, visit www.chipletsummit.com.