OIF to Showcase Advancements in Common Electrical I/O (CEI) Development and Energy-Efficient Interfaces (EEI) for AI Compute at DesignCon 2025

FREMONT, Calif.--(BUSINESS WIRE)--Showcasing its commitment to connecting with technical professionals in chip, board and systems design, OIF will host two panels at DesignCon 2025, the premier event for the high-speed communications and semiconductor industries taking place Jan. 28-30 in Santa Clara.

The sessions will highlight OIF’s work and advancements in Common Electrical I/O (CEI) development and its commitment to Energy Efficiency Interfaces (EEI) in next-generation AI compute systems. Details are as follows:

Panel 1 – Wednesday, Jan. 29, 2025 – 4 PM to 5:15 PM PT

OIF Update on 224 Gbps & 448 Gbps Common Electrical I/O (CEI) Development – Moderated by Nathan Tracy, OIF President (TE Connectivity), this panel will feature OIF experts who will explore the latest advancements in CEI development and address the challenges and opportunities of supporting the rapidly evolving requirements for higher data rates.

Panelists: Cathy Liu, OIF Vice President (Broadcom); Mike Li, OIF Board Member (Intel); Srinivas Venkataraman (Meta); and John Calvin (Keysight)

Panel 2 – Thursday, Jan. 30, 2025 – 1:15 PM to 2 PM PT

EEI for the Next Generation of AI Compute – Jeff Hutchins, OIF Board Secretary/Treasurer and Physical and Link Layer (PLL) Working Group (WG) Energy Efficient Interfaces (EEI) Vice Chair (Ranovus), will moderate this panel, which will examine EEI technologies vital to enabling scalable AI compute and networking solutions, a cornerstone of future data center sustainability.

Panelists: Mike Klempa, OIF Board Member and PLL Interoperability WG Chair (Alphawave Semi); Sam Kocsis, OIF Technical Committee Vice Chair (Amphenol); and Nathan Tracy, OIF President (TE Connectivity)

“These two panels exemplify how important it is for OIF to engage with DesignCon’s highly technical and influential audience of engineers and system architects,” Tracy said. “By presenting at DesignCon, we ensure these key audiences are equipped with the latest updates on OIF’s work in high-speed design and AI compute systems, enabling them to effectively address their specific needs and challenges.”

For more information about OIF’s panels at DesignCon 2025, visit OIF’s website.

CMIS Technical Webinar Series: Besides participating at DesignCon, OIF is hosting a series of free public CMIS tutorial webinars designed to provide engineers, developers and industry professionals with a comprehensive understanding of CMIS. The next session in the series, focused on the Versatile Control Set (VCS), will be presented by Luz Osorio, Systems Design Architect at Ciena, on Wednesday, March 5, 2025. More information on the series can be found here.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and http://www.oiforum.com.