OIF Unveils Three New CMIS Implementation Agreements – CMIS 5.3, ELSFP Pluggable CMIS, CMIS-FF – and a New White Paper “CMIS: Path to Plug-and-Play”

New specification agreements and white paper set the path toward enhanced interoperability and plug-and-play capabilities

FREMONT, Calif.--(BUSINESS WIRE)--OIF has unveiled the latest Common Management Interface Specification (CMIS) Implementation Agreement (IA) (version 5.3); the External Laser Small Form Factor (ELSFP) Pluggable CMIS IA; the Formfactor Specific Hardware Management (CMIS-FF) IA; and a new white paper titled “CMIS: Path to Plug and Play.”

“These industry-critical IAs represent significant strides in advancing CMIS interoperability across the industry,” said Gary Nicholl, OIF Board Member and Physical and Link Layer (PLL) Working Group – Management Co-Vice Chair, and Cisco. “These new standards not only enhance the functionality of modules but also streamline the integration process, reducing the time to market for new technologies.”

CMIS 5.3 IA

The CMIS 5.3 IA is a critical update to OIF’s core CMIS document. In addition to multiple maintenance updates to improve useability and correct errors, this update provides new functionality in many spaces including Co-Packaged Optics, ELSFP, serial peripheral interface (SPI) interface, Link Training and support for more applications. As part of our “Path to Plug and Play” initiative, this update also adds new advertising capabilities that let the modules better advertise their capabilities to hosts. This new advertising includes items like per application power consumption and descriptions of custom media/host codes.

This specification applies to various pluggable or on-board modules such as QSFP Double Density (QSFP-DD), OSFP, COBO and QSFP, as well as future module developments. The CMIS 5.3 IA is a critical resource for systems manufacturers, system integrators and suppliers of CMIS-compliant modules, enabling them to ensure seamless management communication between host systems and modules through a two-wire interface.

ELSFP Pluggable CMIS IA

The ELSFP Pluggable CMIS IA, developed in response to the increasing demand for external laser small form factor modules, extends the memory map defined in CMIS to include objects for controlling ELSFP modules. This agreement is vital for aligning the management interface of ELSFP modules with the overarching CMIS framework, ensuring consistent and reliable control through a two-wire communication protocol.

CMIS-FF IA

The Formfactor Specific Hardware Management (CMIS-FF) IA provides a comprehensive specification for managing hardware controls in conjunction with CMIS. CMIS-FF supplements CMIS by defining form factor specific hardware signal usage on a per form factor basis and offering an equivalent management framework to existing standards like SFF-8472, SFF-8636 and SFP-DD MSA MIS. This agreement allows form factors that do not include the same hardware control pins as CMIS managed modules to map functionality to different pins/registers, enabling these form factors to use CMIS for management.

See all the CMIS IAs here.

White Paper: “CMIS: Path to Plug and Play”

Along with these new IAs, OIF has also released a white paper titled “CMIS: Path to Plug and Play.” This paper outlines how CMIS advertising enables hosts to write generic software for managing CMIS-compliant modules, significantly reducing integration time and accelerating the deployment of new capabilities in end-user networks. By promoting a standardized provisioning model, this white paper highlights how CMIS 5.3 enhancements pave the way for true plug-and-play functionality in the industry.

“The launch of the Path to Plug and Play white paper underscores OIF’s commitment to simplifying and accelerating the deployment of CMIS,” said Ian Alderdice, OIF PLL WG – Management Co-Vice Chair and Ciena. “By providing a clear path to plug-and-play capabilities, we are empowering the industry to meet the growing demands of high-speed networks with greater efficiency and reliability.”

For more information on the new IAs and white paper or to learn more about OIF’s ongoing work, please visit OIF’s website.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at http://www.oiforum.com.