-

JEDEC® Announces Publication of Compute Express Link® (CXL®) Support Standards

ARLINGTON, Va.--(BUSINESS WIRE)--JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD405-1B JEDEC® Memory Module Label – for Compute Express Link® (CXL®) V1.1. JESD405-1B joins JESD317A JEDEC® Memory Module Reference Base Standard – for Compute Express Link® (CXL®) V1.0, first introduced in March 2023, in defining the function and configuration of memory modules that support CXL specifications, as well as the standardized content for labels for these modules. JESD405-1B and JESD317A were developed in coordination with the Compute Express Link standards organization. Both standards are available for free download from the JEDEC website.

JESD317A provides detailed guidelines for CXL memory modules including mechanical, electrical, pinout, power and thermal, and environmental guidelines for emerging CXL Memory Modules (CMMs). These modules conform to SNIA (Storage Networking Industry Association) EDSFF form factors E1.S and E3.S to provide end-user friendly hot pluggable assemblies for data centers and similar server applications.

JESD405-1B defines the contents of labels for these CMMs, assisting end users in selecting the appropriate CXL memory solutions. The labels include information regarding the memory media type, such as DDR5, the revision level of the supported CXL protocol, total capacity in gigabytes or terabytes, and support for connector and I/O configurations from a x4 to x16 over a single connector (1C) through four connectors (4C). Release version 1.1 includes documentation for the country of origin of the module assembly readable in the required 2D barcode, simplifying inventory management.

“Both JESD317A and JESD405-1B affirm JEDEC’s active support for expanding the market for CXL solutions. These documents represent the cooperation of dozens of companies representing suppliers and end users of CXL memory solutions,” said Mian Quddus, JEDEC Board of Directors Chairman. “End users can be assured of a multiplicity of sources for CXL memory modules, helping to commoditize these solutions for the good of the industry.”

About JEDEC

JEDEC is the global leader in the development of standards for the microelectronics industry. Thousands of volunteers representing over 350 member companies work together in more than 100 JEDEC committees and task groups to meet the needs of every segment of the industry, for manufacturers and consumers alike. The publications and standards generated by JEDEC committees are accepted throughout the world. All JEDEC standards are available for download from the JEDEC website. For more information, visit https://www.jedec.org.

Contacts

Emily Desjardins
emilyd@jedec.org
703-907-7560

JEDEC


Release Versions

Contacts

Emily Desjardins
emilyd@jedec.org
703-907-7560

More News From JEDEC

JEDEC® Announces Updates to Universal Flash Storage (UFS) and Memory Interface Standards

ARLINGTON, Va.--(BUSINESS WIRE)--JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of its highly anticipated JESD220H and JESD223G: Universal Flash Storage 5.0 and UFS Host Controller Interface (UFSHCI) 5.0. Designed for mobile applications, automotive and computing systems that demand high performance with low power consumption, UFS 5.0 will deliver faster data access and improved perfo...

JEDEC Board Presents 2026 Distinguished Executive Leadership Award to HPE President and CEO Antonio Neri

ARLINGTON, Va.--(BUSINESS WIRE)--The JEDEC Board of Directors presented its prestigious 2026 Distinguished Executive Leadership Award to Antonio Neri, HPE President and CEO, in a ceremony held on Tuesday, Feb. 3 at HPE’s office near Houston, Texas. This award stands as JEDEC’s highest honor and recognizes the most distinguished senior executives in the electronics industry who promote and support the advancement of JEDEC standards. “JEDEC is honored to recognize Mr. Neri for his exceptional ded...

JEDEC Prepares SPHBM4 Standard to Deliver HBM4-Level Throughput with Reduced Pin Count

ARLINGTON, Va.--(BUSINESS WIRE)--JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is nearing completion of a new standard for Standard Package High Bandwidth Memory (SPHBM4). SPHBM4 devices are similar to the HBM4 devices commonly used in artificial intelligence accelerators, using the same DRAM dies on a new interface base die which can be mounted on standard organic substrates. In contrast, HBM4 is typic...
Back to Newsroom