-

Intel CEO Pat Gelsinger Receives 2024 Distinguished Executive Leadership Award from JEDEC Board

ARLINGTON, Va.--(BUSINESS WIRE)--The JEDEC® Board of Directors presented its prestigious 2024 Distinguished Executive Leadership Award to Intel CEO, Pat Gelsinger, in a ceremony held at Intel’s offices in Santa Clara, CA earlier this month. This award stands as JEDEC’s highest honor and recognizes the most distinguished senior executives in the electronics industry who promote and support the advancement of JEDEC standards.

“Throughout Pat Gelsinger’s distinguished career, he has consistently championed the development of open standards, as evidenced by Intel’s contributions in this domain. Under his leadership, Intel has made a tremendous impact on many groundbreaking memory and IO technologies in JEDEC,” said Mian Quddus, JEDEC Board of Directors Chairman. He added, “JEDEC is grateful for his invaluable support and that of the Intel team.”

Pat Gelsinger, chief executive officer of Intel Corporation, has more than four decades of technology leadership and experience driving innovation, with 30 of those years serving in Intel engineering and executive roles. He managed the creation of key industry technologies like USB and Wi-Fi. He was the architect of the original 80486 processor, led 14 microprocessor programs and played key roles in the Intel® Core™ and Intel® Xeon® processor families, leading to Intel becoming the world’s preeminent microprocessor supplier.

About JEDEC

JEDEC is the global leader in the development of standards for the microelectronics industry. Thousands of volunteers representing over 350 member companies work together in more than 100 JEDEC committees and task groups to meet the needs of every segment of the industry, manufacturers and consumers alike. The publications and standards generated by JEDEC committees are accepted throughout the world. All JEDEC standards are available for download from the JEDEC website. For more information, visit https://www.jedec.org/.

Contacts

Emily Desjardins
703-907-7560
emilyd@jedec.org

JEDEC Solid State Technology Association


Release Versions

Contacts

Emily Desjardins
703-907-7560
emilyd@jedec.org

More News From JEDEC Solid State Technology Association

JEDEC’s SOCAMM2: Low Power Compact LPDDR5X Modules Poised to Power Next-Gen AI Servers

ARLINGTON, Va.--(BUSINESS WIRE)--JEDEC® Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is nearing completion of JESD328: LPDDR5/5X Small Outline Compression Attached Memory Module (SOCAMM2) Common Standard, an upcoming standard for low-profile LPDRAM modules developed specifically for data center AI applications. When published, JESD328 is designed to provide a memory platform that delivers modular, low-power,...

JEDEC Announces Annual Update of DDR5 Serial Presence Detect (SPD) Contents Standard

ARLINGTON, Va.--(BUSINESS WIRE)--JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, has published the annual release of its JESD400-5D DDR5 Serial Presence Detect (SPD) Contents standard. This latest version 1.4 adds support for memory modules executing up to DDR5-9200 speeds, codes for the new Small Outline Compression Attached Memory Module (SOCAMM2) and expands error logging information for Multiplexed Rank Dual In-Line Mem...

UFS 5.0 Is Coming: JEDEC® Sets the Stage for the Next Leap in Flash Storage

ARLINGTON, Va.--(BUSINESS WIRE)--JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced it is nearing completion of the next version of its highly anticipated Universal Flash Storage (UFS) standard: UFS 5.0. Designed for mobile applications and computing systems that demand high performance with low power consumption, UFS 5.0 plans to deliver faster data access and improved performance compared to its predec...
Back to Newsroom