Global Compound Semiconductor (GaAs, GaN, SiC) Market 2020-2024 - ResearchAndMarkets.com

DUBLIN--(BUSINESS WIRE)--The "Global Compound Semiconductor Market 2020-2024" report has been added to ResearchAndMarkets.com's offering.

The compound semiconductor market is poised to grow by $ 11.74 bn during 2020-2024 progressing at a CAGR of 6% during the forecast period.

The reports on compound semiconductor market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current global market scenario, latest trends and drivers, and the overall market environment. The market is driven by the increasing demand for enhanced power density, rising adoption of smartphones and growing demand for wide-bandgap power devices. In addition, increasing demand for enhanced power density is anticipated to boost the growth of the market as well.

This study identifies the growing adoption of EVs and HEVs as one of the prime reasons driving the compound semiconductor market growth during the next few years. Also, rising adoption of renewable energy sources and increasing industry automation will lead to sizable demand in the market.

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading compound semiconductor market vendors that include Broadcom Inc., Cree Inc., Infineon Technologies AG, Nichia Corp., NXP Semiconductors NV, Qorvo Inc., Samsung Electronics Co. Ltd., Skyworks Solutions Inc., STMicroelectronics NV, and Texas Instruments Inc.

Also, the compound semiconductor market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage on all forthcoming growth opportunities.

Key Topics Covered:

Executive Summary

• Market Overview

Market Landscape

• Market ecosystem
• Value chain analysis

Market Sizing

• Market definition
• Market segment analysis
• Market size 2019
• Market outlook: Forecast for 2019 - 2024

Five Forces Analysis

• Five Forces Summary
• Bargaining power of buyers
• Bargaining power of suppliers
• Threat of new entrants
• Threat of substitutes
• Threat of rivalry
• Market condition

Market Segmentation by End-user

• Market segments
• Comparison by End-user
• Consumer electronics - Market size and forecast 2019-2024
• Communications - Market size and forecast 2019-2024
• Defense and aerospace - Market size and forecast 2019-2024
• Automotive - Market size and forecast 2019-2024
• Others - Market size and forecast 2019-2024
• Market opportunity by End-user

Market Segmentation by Type

• Market segments
• Comparison by Type
• GaAs - Market size and forecast 2019-2024
• GaN - Market size and forecast 2019-2024
• SiC - Market size and forecast 2019-2024
• Others - Market size and forecast 2019-2024
• Market opportunity by Type

Customer Landscape

Geographic Landscape

• Geographic segmentation
• Geographic comparison
• Key leading countries
• Market opportunity by geography
• Volume drivers - Demand led growth
• Market challenges
• Market trends

Vendor Landscape

• Vendor landscape
• Landscape disruption

Vendor Analysis

• Vendors covered
• Market positioning of vendors
• Broadcom Inc.
• CREE Inc.
• Infineon Technologies AG
• Nichia Corp.
• NXP Semiconductors NV
• Qorvo Inc.
• Samsung Electronics Co. Ltd.
• Skyworks Solutions Inc.
• STMicroelectronics NV
• Texas Instruments Inc.

Appendix

For more information about this report visit https://www.researchandmarkets.com/r/lj5vut