-

Molex Showcases Next-Generation Automotive Electronic Solutions at the Virtual Bordnetz Kongress 2020

Key subject matter experts will present capabilities for in-vehicle miniaturized electronics

LISLE, Ill.--(BUSINESS WIRE)--Molex will showcase next-generation automotive electronic capabilities for the connected and autonomous car at the Bordnetz Kongress being held virtually on September 22, 2020. Molex, a Gold Sponsor of the event, will present on the impact of miniaturization in the automotive market and increased vehicle life on terminals designs, such as ‘Zero Wear’ technology during the closing keynote presentation.

The automotive industry is facing a tremendous transformation. Current demands for increased bandwidth, enhanced safety and sophisticated anti-hacking systems for autonomous platforms are driving exponential growth in the number of connectors used within vehicles. At the same time, connectors need to fit into smaller spaces making the need for miniaturization even more critical.

“To support autonomous driving, OEMs are building more electronic content into vehicles with sophisticated digital capabilities, powertrain electrification and driver assist systems. As a result, many sensor-driven control units with multiple printed circuit boards now have kilometers of new cabling and an exponential number of new connections, all of which compete for space in dense car architectures,” said Jeremy Stout, director of product management, Molex.

Molex subject matter experts, Mr. Stout and Dr. Deepak Patil, manager, contacts physics engineering will address these trends during the event’s closing keynote presentation “The Future of Automotive Interconnects: Why Bigger Isn’t Always Better.”

“Molex is the pioneer of novel terminal interface ‘ZeroWear’ technology, which is a key enabler for higher circuit count miniaturized systems and extended life systems targeting million miles,” added Dr. Patil.

The first ever virtual Bordnetz Kongress can be accessed on a laptop, desktop computer or mobile device. The congress focuses on developers and technical experts from the entire automotive value chain including OEMs, Tier 1 suppliers, manufactures and service providers.

For more information on registration please click here. For more information about the Molex Automotive solutions please visit: https://experience.molex.com/electronic-solutions/bordnetz-kongress/

About Molex:

Molex makes a connected world possible by enabling technology that transforms the future and improves lives. With a presence in more than 40 countries, Molex offers a full range of connectivity products, services and solutions for markets that include data communications, medical, industrial, automotive and consumer electronics. For more information, visit http://www.molex.com.

Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.

Contacts

FOR EDITORIAL INFORMATION
Christa Carroll
Senior Vice President
Outlook Marketing Services
630.408.9164
Christa@outlookmarketingsrv.com

Molex


Release Summary
Molex Showcases Next-Generation Automotive Electronic Solutions at the Virtual Bordnetz Kongress
Release Versions

Contacts

FOR EDITORIAL INFORMATION
Christa Carroll
Senior Vice President
Outlook Marketing Services
630.408.9164
Christa@outlookmarketingsrv.com

More News From Molex

 Molex Expands Innovative Line of NearStack High-Speed Cable Assembly Solutions to Help Customers Maximize System Performance

LISLE, Ill.--(BUSINESS WIRE)--Molex, a leading global manufacturer of electronic solutions, is pleased to announce the expansion of its industry-leading NearStack High-Speed Cable Solutions to include the NearStack 100 Ohm and NearStack 85 Ohm solutions. The extended portfolio helps organizations manage costs, reduce insertion loss and improve signal integrity. Telecommunication and data center companies continue to experience increasing bandwidth requirements and, therefore, need high-density...

Molex’s BittWare Adds Open Compute M.2 Accelerator Module to Growing Portfolio of FPGA-based Products

CONCORD, N.H.--(BUSINESS WIRE)--BittWare, a Molex company, the leading supplier of enterprise-class NVMe computational storage products featuring FPGA technology, today announces the launch of the 250-M2D Accelerator Module. This FPGA-based Computational Storage Processor (CSP) was designed to meet the new Open Compute M.2 Accelerator Module standard intended to operate in Glacier Point carrier cards for Yosemite servers. These feature-rich, dense servers are favored by hyperscale and cloud com...

Molex Recognizes TTI with the 2019 Molex Americas Distributor of the Year Award

LISLE, Ill.--(BUSINESS WIRE)--Molex has announced that TTI, Inc. is the recipient of the 2019 Americas Distributor Award. This award recognizes one outstanding regional channel partner each year for advancing Molex technology solutions through demonstrated growth in worldwide sales coupled with global financial, operational and executive management excellence. TTI receives this award as a leading channel partner on both global and regional excellence. TTI and Molex have strategic initiatives in...
Back to Newsroom