Semiconductor News
Explore semiconductor technology trends and innovations in chip design and manufacturing. Learn how semiconductors power modern electronics and drive innovation in computing, communications, and consumer devices globally.
May 25, 2026 at 10:00 PM
Toshiba Starts Shipping Engineering Samples of TXZ+™ Family Entry‑Class M4H Group, Standard Microcontrollers with Arm® Cortex®‑M4 Core for System Control Applications
KAWASAKI, Japan--(BUSINESS WIRE)--Toshiba introduces entry-level microcontrollers with an Arm® Cortex®‑M4 core for small‑scale system control in consumer and industrial applications....
May 25, 2026 at 4:16 AM
JEOL: Sales Launch of the Laser SEM System “LazEdge”
TOKYO--(BUSINESS WIRE)--JEOL Ltd. (President & CEO: Izumi Oi) has developed the “LazEdge”, an SEM system equipped with a laser processing system, and begins sales on May 25, 2026. Cross-section preparation instruments such as the focused ion beam system (FIB system), are widely used in science and technology fields across research institutes, universities, and industries. In recent years, demand is increasing for a system that can process large-areas at a high speed, while achieving high-qu...
May 22, 2026 at 8:00 AM
NTT, NTT DATA and INDYCAR Extend Entitlement Partnership with Multi-Year Agreement
TOKYO & INDIANAPOLIS--(BUSINESS WIRE)--NTT, Inc., together with NTT DATA Group Corporation, today announced the renewal of its sponsorship of the NTT INDYCAR SERIES. Under the renewed agreement, NTT has expanded its role beyond race analytics and fan engagement to provide advanced AI and data capabilities for Penske Entertainment and INDYCAR. This includes AI-driven operations, real‑time decision intelligence and emissions visibility across INDYCAR, the historic Indianapolis Motor Speedway (IMS...
May 21, 2026 at 6:30 PM
Lightmatter Unveils Guide DR: Industry First Liquid-Cooled Laser NIC that Quadruples Rack Density
MOUNTAIN VIEW, Calif.--(BUSINESS WIRE)--Lightmatter, the leader in photonic (super)computing, today announced Guide® DR, a high-density laser in an innovative Laser Network Interface Card (“LNIC”) form factor built to OCP NIC 3.0 dimensions. The Guide DR LNIC is a modular, high-density laser array that enables approximately four times the rack density of conventional External Laser Small Form Factor Pluggables (ELSFPs). By relocating the light source from the faceplate into the chassis, the Gui...
May 21, 2026 at 4:05 PM
Butterfly Network to Participate in the William Blair 46th Annual Growth Stock Conference
NEW YORK & BURLINGTON, Mass.--(BUSINESS WIRE)--Butterfly Network, Inc. (NYSE: BFLY) (“Butterfly”), today announced that the company will participate at the William Blair 46th Annual Growth Stock Conference. Joseph DeVivo, President, Chief Executive Officer & Chairman and John Doherty, EVP, Chief Financial Officer will participate in a presentation breakout session at 8:40 AM CT on June 4, 2026, and host one-on-one investor meetings throughout the day. A webcast of the presentation will be a...
May 21, 2026 at 10:23 AM
Google DeepMind Features Hirundo’s Security-Hardened Gemma 4 Model – Outperforms LLMs 170x Its Size on Security
TEL AVIV, Israel--(BUSINESS WIRE)--Google DeepMind has featured Hirundo’s security-hardened variant of Gemma 4 in its Gemmaverse – the official showcase for the Gemma open-model ecosystem. The feature validates Hirundo’s weight-level machine unlearning approach as a production-grade solution to one of the most persistent vulnerabilities in enterprise AI deployments: prompt injection attacks. The hardened model is built on Google’s Gemma 4 E4B instruction-tuned base. At 4 billion parameters, it...
May 21, 2026 at 9:00 AM
NTT DATA Globalizes Sales and Client Services of its Data Center Business to Support Growing Worldwide AI and Cloud Customer Base
LONDON--(BUSINESS WIRE)--NTT DATA, a global leader in AI, digital business and technology services, today announced the evolution of its Global Data Centers sales and client services model as the business continues to scale to meet customers’ growing demand for agile, globally distributed data center infrastructure powering next-generation AI and cloud workloads. As organizations deploy AI and cloud platforms across multiple regions, customers increasingly require globally integrated data cente...
May 21, 2026 at 9:00 AM
Supra Joins the U.S. Department of War’s Defense Industrial Base Consortium (DIBC)
AUSTIN, Texas--(BUSINESS WIRE)--Supra Elemental Recovery, Inc. (“Supra”), a U.S. technology startup developing a proprietary critical minerals recovery platform, today announced that it has joined the Defense Industrial Base Consortium (“DIBC”), a collaborative initiative focused on advancing secure, innovative, and resilient solutions for the nation’s defense industrial base. As a member, Supra looks forward to working with other DIBC partners to share best practices, contribute to research, a...
May 21, 2026 at 8:30 AM
Asahi Kasei Develops Novel Photosensitive Polyimide Film for Advanced Panel-Level Semiconductor Packaging
TOKYO--(BUSINESS WIRE)--Asahi Kasei has combined the features of its photosensitive polyimide (PSPI) and dry film photoresist (DFR) into a new photosensitive film....
May 21, 2026 at 8:00 AM
Wolfspeed Introduces New 3.3 kV SiC Power Modules in Two Industry-Standard Footprints to Address the Surging Demand for Energy
DURHAM, N.C.--(BUSINESS WIRE)--Wolfspeed has introduced two new 3.3 kV silicon carbide (SiC) power module families – including high-power half-bridge baseplate modules and scalable full-bridge baseplate-less modules in industry-standard footprints — that are purpose-built to address the rapidly approaching power constraints driven by AI data centers and the broader energy transition. Meeting this moment requires power generation, conversion, and distribution that is faster, smaller, more effici...
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