Semiconductor News
Explore semiconductor technology trends and innovations in chip design and manufacturing. Learn how semiconductors power modern electronics and drive innovation in computing, communications, and consumer devices globally.
Mar 12, 2026 at 5:19 PM
Upwind Partners with Microsoft to Deliver Runtime Security for Azure Workloads
SAN FRANCISCO--(BUSINESS WIRE)--Upwind, the runtime-first cloud security leader, today announced a partnership with Microsoft to deliver a unified Azure security solution to enterprises worldwide. The partnership brings together runtime protection, posture management, and vulnerability detection in a single experience, giving organizations continuous and integrated visibility across their Azure environments. Available on the Microsoft Marketplace, the solution offers deep alignment with Azure’s...
Mar 12, 2026 at 4:05 PM
Penguin Solutions Announces Second Quarter Fiscal 2026 Conference Call
FREMONT, Calif.--(BUSINESS WIRE)--Penguin Solutions will host its quarterly financial webcast & conf call for Q2FY2026 earnings after market close Wed April 1 at 1:30 pm PT/4:30 pm ET....
Mar 12, 2026 at 3:57 PM
Avicena Launches the World’s First microLED Optical Interconnect Evaluation Kit for AI Infrastructure Innovators
SUNNYVALE, Calif.--(BUSINESS WIRE)--Avicena, the pioneer in microLED-based optical interconnects, today announced the LightBundle™ eKit, the industry’s first evaluation platform for microLED optical connectivity using ASIC-based transceivers with integrated LED, photodetector (PD) and micro-lens arrays connected via a multi-core fiber bundle. The kit enables hyperscaler, AI accelerator, high-bandwidth memory (HBM), networking, and AI infrastructure architects to evaluate next-generation optical...
Mar 12, 2026 at 2:23 PM
Movandi CEO Maryam Rofougaran Named to Inc.’s 2026 Female Founders 500 for Building the Connectivity Infrastructure Powering the AI Era
IRVINE, Calif.--(BUSINESS WIRE)--Movandi CEO Maryam Rofougaran named to Inc.’s 2026 Female Founders 500 for Building the Connectivity Infrastructure Powering the AI Era...
Mar 12, 2026 at 11:00 AM
NeuReality Unveils NR-NEXUS Inference Operating System for AI Token Factories
TEL AVIV, Israel--(BUSINESS WIRE)--NeuReality, a pioneer in AI infrastructure, today introduced NR-NEXUS, an inference operating system designed to power large-scale inference services. Already deployed with beta customers, NR-NEXUS enables organizations to transform fragmented systems into production-ready token factories. The platform was developed based on NeuReality’s deep expertise in AI hardware architecture and large-scale inference system design. It marks the next step in building the f...
Mar 12, 2026 at 11:00 AM
Keysight Introduces 220 GHz Lightwave Component Analyzer to Validate Next-Generation Optical Transceiver Technology
SANTA ROSA, Calif.--(BUSINESS WIRE)--New analyzer accelerates design and validation of 1.6/3.2 Tb/s optical transmitter and receiver components for high-speed optical interconnects....
Mar 12, 2026 at 9:51 AM
LZE GmbH Introduces Fraunhofer’s RFicient® Technology to the Market
ERLANGEN, Germany--(BUSINESS WIRE)--LZE GmbH is expanding its technology transfer portfolio and making the RFicient® ultra-low-power wake-up receiver technology from the Fraunhofer Institute for Integrated Circuits IIS available for the first time as a standard chip for close-to-production industrial applications. The solution enables energy-efficient IoT designs that remain continuously reachable while consuming only microamps – a key step for long-lasting, low-maintenance IoT products. LZE Gm...
Mar 12, 2026 at 9:05 AM
Marvell to Showcase Industry-leading, End-to-End Connectivity Solutions for AI Data Center Infrastructure at OFC 2026
SANTA CLARA, Calif.--(BUSINESS WIRE)--Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced it will showcase the industry’s most comprehensive portfolio of AI data center connectivity solutions at OFC 2026—March 15 to 19 at the Los Angeles Convention Center in Los Angeles, California. As AI infrastructure scales exponentially, connectivity has become the primary bottleneck of modern hyperscale and cloud data centers, and new, dedicated...
Mar 12, 2026 at 9:03 AM
HyperLight Introduces 145 GHz Reference Modulators to Enable 448Gbps per Lane Datacom and 260GBaud Telecom Development
CAMBRIDGE, Mass.--(BUSINESS WIRE)--HyperLight Corporation, creator of the TFLN Chiplet™ platform, today announced the release of its 145 GHz Packaged Intensity Modulator (IM), expanding the company‘s high-speed modulator portfolio. The new device is designed for ultra-wide modulation bandwidth, high signal fidelity, and stable operation control, enabling 448 Gbps per lane intensity-modulated-direct-detection (IMDD), 260 GBaud coherent links, and broadband RF photonics systems. As symbol rates...
Mar 12, 2026 at 9:02 AM
Marvell Ushers In the 1.6T Era with Expanded Optical DSP Platform Portfolio, Redefining AI Data Center End-to-End Connectivity
SANTA CLARA, Calif.--(BUSINESS WIRE)--Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced a major expansion of its 1.6T optical DSP platform portfolio, advancing the industry’s transition from 800G into 1.6T next-generation AI data center connectivity. Marvell has a multi-generational history of industry firsts. The company was the first to introduce 200G/lane 1.6T DSPs in 5nm with Marvell® Nova in 2023, followed by the 3nm 1.6T Ara...
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