-

Qnity Expands Domestic Manufacturing Footprint to Accelerate Semiconductor Industry Growth

New facility scales critical CMP materials production to meet rising demand from AI and high-performance computing

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today celebrated the opening of its new 385,000-square-foot facility with a ribbon-cutting ceremony in Newark, Delaware.

The new facility, part of a multi-year investment to expand advanced manufacturing, increases capacity to meet rising demand for semiconductor materials driven by the rapid growth of AI, high performance computing, and advanced connectivity — all of which are contributing to the semiconductor industry's projections of $1 trillion in global revenue in the next few years.

“The expansion of Qnity’s domestic manufacturing footprint further strengthens our operational agility to meet ever-shifting customer needs, ensure global and regional capacity, and advance collaborative innovation through strategic investments,” said Jon Kemp, Chief Executive Officer at Qnity.

The location is home to a newly commissioned manufacturing line producing components for Qnity’s leading chemical mechanical planarization (CMP) pads, the polishing discs used for smoothing the chip’s surface during fabrication, an area in which Qnity is a leader in the global supply chain.

The line provides enhanced reliability and quality improvements essential for the use of CMP pads at the most cutting-edge, advanced nodes, where the complexity of AI chip fabrication requires more CMP steps per wafer during production, a source of major growth potential for CMP materials in the era of AI transformation.

Attended by Delaware Governor Matt Meyer and other government and community leaders and partners, the ceremony officially commemorated the opening of the new facility’s first manufacturing line.

“Delawareans win the future when we build the things that power next generation technologies for the world,” said Governor Matt Meyer. “Qnity is doing just that, which means more jobs and more opportunity, and reminds us that Delawareans are manufacturing the future of semiconductors and advanced electronics right here, outside Newark."

Visit qnityelectronics.com to learn more about how Qnity is powering the next leap in electronics.

About Qnity
Qnity is a premier technology provider across the semiconductor value chain, empowering AI, high performance computing, and advanced connectivity. From groundbreaking solutions for semiconductor chip manufacturing, to enabling high-speed transmission within complex electronic systems, our high-performance materials and integration expertise make tomorrow’s technologies possible. More information about the company, its businesses and solutions can be found at www.qnityelectronics.com.

Qnity™, the Qnity Node Logo, and all products, unless otherwise noted, denoted with TM or ® are trademarks, trade names or registered trademarks of affiliates of Qnity Electronics, Inc.

Contacts

Media Contact
Ashley Boucher
ashley.boucher@qnityelectronics.com

Qnity Electronics, Inc.

NYSE:Q
Details
Headquarters: Wilmington, Delaware
CEO: Jon Kemp
Employees: 10,000
Organization: PUB

Release Versions

Contacts

Media Contact
Ashley Boucher
ashley.boucher@qnityelectronics.com

More News From Qnity Electronics, Inc.

Qnity Launches Optivision™ Max CMP Pad Family to Enable Next-Generation Semiconductor Manufacturing

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced the expansion of its offerings for chemical mechanical planarization (CMP) with the introduction of Optivision™ Max polishing pads. As semiconductor devices continue to shrink and increase in complexity, diverse CMP processes are critical to achieving the precision required for reliable device performance. Optivision™ Max CMP...

Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia™ 8540HSP multi-role copper and Cyclotene™ DF6800M dry film photo-imageable dielectric. The material innovations are designed to support advanced interconnect formation, redistribution layer (RDL) designs, and emerging glass-based substrate str...

Qnity Named ASE 2025 Best Supplier in Advanced Packaging Materials

WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced it received the 2025 ASE Best Supplier Award from ASE Technology Holding Co., Ltd., one of the world’s largest outsourced semiconductor assembly and test providers (OSATs), headquartered in Taiwan, for its silicone-based materials. An honor bestowed on ASE partners, the annual award recognizes those who provide outstanding pe...
Back to Newsroom