-

Ventiva Unveils Intelligent Air-Cooling Solution for Electronics that Delivers Up To 100 Watts

Company to demonstrate ICE9 innovation developed for new era of AI and discrete graphics at Computex 2025

TAIPEI, Taiwan--(BUSINESS WIRE)--Ventiva®, the leader in thermal solutions, today announced it will demonstrate a laptop thermal test vehicle (TTV) of its ICE9™ thermal management system, providing up to 100W thermal design power (TDP) for high-performance devices, at Computex 2025.

This is our highest-performing thermal management system to date, enabling laptop OEMs and ODMs to push power to the limit, and stay totally cool, under any workload, from 3D design to AI development to immersive game playing.

Share

With increased AI and graphics processing capabilities, laptops are shifting from traditional computing devices to powerful AI-driven machines that enhance productivity, creativity, and entertainment. To support these advanced high-performance capabilities, next-generation devices require greater processing power as well as heat transfer technology to keep them cool. However, traditional cooling solutions such as fans and vents have reached their limits in both performance and form factor adaptability. In addition, they create excessive noise and vibrations that can cause distractions for use cases such as gaming, video editing, or coding.

Ventiva’s ICE9 thermal management system uses the company’s Ionic Cooling Engine (ICE®) technology to cool electronic devices without moving parts, noise, or vibration, enabling devices that are thin, silent, and totally cool. With the enhanced, intelligent system controller, the innovative air-cooling system is able to dynamically respond to the device environment, enabling it to identify and combat dust throughout a product’s lifespan to prevent overheating and system degradation.

“AI-driven laptops are transforming the way we work, create, and play, but their increasing thermal output requires a new level of device heat management,” said Carl Schlachte, Chairman, President and CEO, Ventiva. “This is our highest-performing thermal management system to date, enabling laptop OEMs and ODMs to push power to the limit, and stay totally cool, under any workload, from 3D design to AI development to immersive game playing.”

About ICE Technology

Ventiva’s patented ICE technology generates movement of air without any moving parts, noise, or vibration, leveraging the principles of electrohydrodynamic (EHD) flow to move ionized air molecules within an electric field. The ICE9 thermal management suite offers an intelligent cooling solution that continuously monitors its operation, delivering more or less airflow as an electronic system requires. Combining advanced monitoring and algorithms, the ICE9 suite’s real-time software can be combined with overall system performance monitoring to provide a robust, device-wide thermal solution.

About Ventiva

Ventiva, a leading company in active cooling solutions for electronic devices, enables thinner, faster, and cooler high-performance devices that are lightweight, silent, and vibration-free. The company’s patented ICE® technology is a pioneering all-electronic heat transfer technology created to address the thermal problems exacerbated by modern high-performance semiconductor design. Learn more at http://www.ventiva.com or follow us on LinkedIn.

© 2025, Ventiva, Inc. All rights reserved. VENTIVA, ICE, and ICE9 are trademarks or registered trademarks of Ventiva. Inc., in the U.S. and other countries. All other trademarks are the property of their respective owners.

Contacts

Media Contact:
Julie Seymour
Ventiva
julie.seymour@ventiva.com

Ventiva


Release Versions

Contacts

Media Contact:
Julie Seymour
Ventiva
julie.seymour@ventiva.com

More News From Ventiva

Ventiva Partners with ASUS to Explore Next-Generation Thermal Architectures for Compact AI Computing Systems

TAIPEI, Taiwan--(BUSINESS WIRE)--Ventiva®, a leader in solid-state cooling solutions, today announced at Computex 2026 a strategic partnership with ASUS to explore next-generation thermal architectures for compact AI computing systems. Through this collaboration, the companies will evaluate how Ventiva's ionic cooling technology can support future ASUS NUC and Mini-PC designs. As AI workloads demand more processing power in increasingly constrained form factors, thermal management has emerged a...

Ventiva Showcases AMD-Powered AI-Ready Laptop Reference Design at CES

LAS VEGAS--(BUSINESS WIRE)--Ventiva®, a leader in thermal solutions, today introduced its new AI-Ready Laptop reference design, powered by the latest AMD Ryzen series mobile processor, at CES 2026. AI workloads are reshaping laptop system architecture, with large language models (LLMs), sustained high-power operation, and increasing on-device inference generating concentrated heat that conventional fan-based cooling struggles to manage. Through this reference design, Ventiva is demonstrating ho...

Ventiva Showcases New Laptop Reference Designs with Compal at CES

LAS VEGAS--(BUSINESS WIRE)--Ventiva®, a leader in thermal solutions, today announced it is showcasing two new laptop reference designs with Compal at CES 2026. These new designs, which are built around Ventiva’s ionic cooling-based thermal management solutions, are intended to help accelerate the development of laptops that can run advanced AI tasks directly on the device. AI workloads are reshaping laptop system architecture, with large language models (LLMs), sustained high-power operation, a...
Back to Newsroom