-

Chiplet Summit Helps Designers Create Huge Chips

Chiplets Reduce Development Time and Cost

SAN DIEGO--(BUSINESS WIRE)--Chiplet Summit debuts at the San Jose Doubletree Hotel on January 24-26, 2023. It focuses on techniques that extend Moore’s Law to ever-smaller dimensions. Chiplets reduce costs, increase modularity and scalability, and avoid wastage and manufacturing defects. Chiplets lead to better chips and faster time-to-market.

The Summit will feature major vendor keynotes, expert tables, and technology and market updates. It will also offer sessions on architectures, development methods, and applications, as well as panels on architectures and platforms, optimization, viable markets, and short-term and long-term trends. Designers will learn to develop high-performance chips at low cost. An exhibit area will showcase the latest products from industry leaders.

“Chiplets help designers control costs and schedules at the latest process nodes. They also allow capture of off-the-shelf designs,” said Chuck Sobey, Chiplet Summit General Chairperson. He noted that, “The event will bring specialists in all aspects of chip development together to ensure successful projects.”

To discuss exhibiting, contact:

Elizabeth Leventhal,
Exhibit Sales Manager
Elizabeth@ChipletSummit.com
+1.760.809.5755

To ask about the program, contact:

Lance Leventhal,
Program Chairperson
Lance@ChipletSummit.com
+1.858.756.3327

About Chiplet Summit

Chiplet Summit showcases the emerging chiplet market. It features the people who are using chiplets in designs for processors, communications chips, and AI devices. The Summit is a product of Semper Technologies.

Contacts

Elizabeth Leventhal
+1.760.809.5755
Press@ChipletSummit.com

Chiplet Summit


Release Versions

Contacts

Elizabeth Leventhal
+1.760.809.5755
Press@ChipletSummit.com

More News From Chiplet Summit

Chiplet Summit Announces its Final Keynote Schedule

SAN DIEGO--(BUSINESS WIRE)--Emphasis is on AI applications. The third annual Chiplet Summit, to occur on January 21-23 at the Santa Clara Convention Center, has now set its final keynote schedule. Companies and organizations giving keynotes will be: Synopsys Alphawave Semi Arm Teradyne Cadence Keysight Open Compute Project There will also be short talks by the UCIe Consortium, Silicon Catalyst, and SNIA. Keynote topics will include AI solutions, design methods, memory, interfaces, new packaging...

Chiplet Summit Features the Latest Chip Design Technology

SAN DIEGO--(BUSINESS WIRE)--Chiplet Summit’s 2025 event offers the last word on leading-edge chip design at the Santa Clara Convention Center on January 21-23. The Tuesday tutorials cover advanced packaging technologies, die-to-die interfaces, design methods, working with foundries, and the Open Chiplet Economy. Wednesday sessions cover creating foundry-ready designs, getting the most from high-bandwidth memory (HBM), and system-technology co-optimization (STCO). Thursday panels discuss viable...

Chiplet Summit Announces its Pre-Conference Day Schedule

SAN DIEGO--(BUSINESS WIRE)--Emphasis is on bringing diverse practitioners up to date on all aspects of chiplets. The third annual Chiplet Summit, to occur on January 21-23 at the Santa Clara Convention Center, has now set its pre-conference day schedule for Tuesday, January 21. Tutorial subjects are: Morning (8:30 am-noon): Chiplet Basics Advanced Packaging Methods Introduction to Die-to-Die Interfaces (sponsored by Alphawave Semi) Afternoon (1:00-5:00 pm): Design Methods Working with Foundries...
Back to Newsroom