-

Cadence and Intel Foundry Services Collaborate to Accelerate Innovation with Scalable and Proven Cadence Cloud Solutions

Highlights:

  • Through the new Intel Foundry Services Cloud Alliance, customers have access to Cadence full-flow design tools, the Cadence Cloud portfolio and Intel advanced process and packaging technologies in a secure, cloud-based design environment
  • Designing in the cloud enables greater efficiency and faster time to market
  • Industry-leading, production-proven Cadence Cloud portfolio offers mutual IFS and Cadence customers a full breadth of cloud offerings via highly flexible business models

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced it has joined the new Intel Foundry Services (IFS) Cloud Alliance to enable customers to leverage scalable design tools from Cadence and the compute power of the cloud. Through the collaboration, users have access to the production-proven Cadence® portfolio and Intel advanced process and packaging technologies in a secure, cloud-based design environment. Using a cloud-based environment, customers can move entire electronic design automation (EDA) flows or specific peak workloads to the cloud as needed, achieving greater efficiency and faster time to market.

By joining the IFS Cloud Alliance, Cadence brings the extensive experience it has gained by working with thousands of customers to accelerate innovation with its proven cloud solutions. To address complex design workloads, the industry-leading, production-proven Cadence Cloud portfolio offers mutual IFS and Cadence customers a full breadth of cloud offerings via highly flexible business models. Over the years, Cadence Cloud portfolio users have successfully accelerated turnaround times for EDA workloads from a few months to a few weeks, improved overall cost efficiency and increased engineering productivity.

“The IFS Cloud Alliance brings easily accessible and scalable compute to help our customers in accelerating their designs, making the cloud accessible to startups, firms with small in-house design teams and companies with established on-premises compute farms alike,” said Rahul Goyal, vice president and general manager of design ecosystem enablement at Intel Foundry Services. “We look forward to helping users achieve design success with the powerful combination of our advanced process and packaging technologies and Cadence design tools.”

“Designing for today’s emerging applications—5G, automotive, industrial internet of things, hyperscale computing, artificial intelligence/machine learning and more—requires the advanced compute power of the cloud,” said Mahesh Turaga, vice president, Cloud Business Development at Cadence. “By joining the IFS Cloud Alliance, we’re enabling joint customers to achieve productivity, scalability, security and flexibility goals with our design tools, the Cadence Cloud portfolio and Intel advanced process and packaging technologies while also helping them speed time to market.”

The Cadence Cloud portfolio supports the company’s Intelligent System Design™ strategy, which enables customers to achieve SoC design excellence. For more information on the portfolio, visit www.cadence.com/go/cloudportifs.

About Cadence

Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For eight years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.

© 2022 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.

Category: Featured

Contacts

Cadence Newsroom
408-944-7039
newsroom@cadence.com

Cadence Design Systems, Inc.

NASDAQ:CDNS
Details
Headquarters: San Jose, California
CEO: Anirudh Devgan
Employees: 12700
Organization: PUB
Revenues: 4.641 Billion (2024)
Net Income: 1.055 Billion (2024)

Release Summary
Cadence joined the Intel Foundry Services Cloud Alliance to enable customers to leverage tools from Cadence and the compute power of the cloud.
Release Versions

Contacts

Cadence Newsroom
408-944-7039
newsroom@cadence.com

Social Media Profiles
More News From Cadence Design Systems, Inc.

Cadence Collaborates With TSMC to Deliver Certified Tool Solutions and Industry-Leading, Silicon-Proven UALink IP on TSMC Advanced Processes

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence (Nasdaq: CDNS) today announced an expanded partnership with TSMC to deliver advanced capabilities for AI and HPC designers. Cadence has achieved tool certification for TSMC’s advanced A14 process, demonstrated an industry-leading UALink solution in TSMC N3P, and introduced new silicon-proven IP for N3P and N2P technologies. Through this partnership, the companies are enabling agentic AI chip and 3D-IC design flows across TSMC's N3, N2, A16™ and A14 pro...

Cadence Expands ChipStack AI Super Agent with a New Agent for RTL Generation and Early PPA Optimization

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence (Nasdaq: CDNS) today introduced a new agent for Cadence® ChipStack™ AI Super Agent that automates front‑end digital design and verification—covering power, performance and area (PPA)-driven spec‑to‑RTL generation, RTL analysis, and refinement; all from natural language prompts. Building on the industry’s first agentic workflow for front‑end design and verification announced in February 2026, this RTL Generation Agent extends the ChipStack AI Super Agen...

Cadence Tensilica IP Powers Analog Devices’ Next-Generation DSP Architecture

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence (Nasdaq: CDNS) today announced that its Tensilica IP Group and Analog Devices, Inc. (ADI) worked together to develop the latest generation of SHARC® automotive audio processors, further strengthening ADI’s industry-leading position in premium in-vehicle audio solutions. The joint effort brings Cadence’s highly optimized Tensilica DSP architecture into the next-generation ADSP product family from ADI, enabling richer audio experiences, enhanced voice in...
Back to Newsroom