TDK Showcases AFM 15 Flip Chip GGI Die Bonder and PLP Load Port at SEMICON West 2019

  • AFM 15 for GGI flip chip back end assembly packaging allows for die size capability 80μm2 ~ 20mm2, low energy die bonding, a clean lead-free process, with high productivity. Micro LED and Large Die thermosonic GGI attach process capability is now available.
  • 650mm PLP, 200mm SMIF, and 200mm Open Cassette load ports address growing PLP and 200mm fab markets.

SAN JOSE, Calif.--()--TDK Corporation (TSE: 6762) will present the latest in load port and flip chip technology at Booth 1926 in the South Hall at the SEMICON West Conference 2019, July 9-11, in the Moscone Center, San Francisco, California.

TDK Corporation product highlights at the show include:

AFM 15 Flip Chip Gold to Gold Interconnect Die Bonder: TDK will feature its AFM GGI flip chip model with horn capability for an even smaller die size of 80μm2 up to 20mm2. TDK horn design provides linear X-Y nozzle movement over a wide range of ultrasonic power settings. Z-axis movement has been reduced by 90 percent during the GGI bonding process. The TDK GGI AFM 15 flip chip die attachment process is a clean, lead-free, precision back end assembly process with low cost of ownership and high productivity. TDK’s AFM 15 can be used for die interconnect assembly of Driver IC, Micro LED, Opto, RF Filters, and MEMS devices.

TDK TAS-PLP Load Port for FO-PLP Panel Level Packaging: TDK has more than 18 years of experience with clean precision load port operation in all major fabs. The TDK TAS-PLP load port is based on our proven load port reliability required by fabs. TDK began TAS-PLP qualification work in 2016 and volume production in 2018. The TDK TAS-PLP load port incorporates SEMI Standard 450 table design with TDK’s fab leading cleanliness standard. TDK TAS-PLP load port operates with 24VDC and air cylinder table actuation to meet the low cost of ownership requirement by fabs. The TDK TAS-PLP load port can handle panel sizes of 500mm ~ 650mm. TDK Options include N2 purge, panel mapping, and ethernet.

TDK 200mm SMIF Loader and Open Cassette Loader for Expanding Fab Growth: TDK’s TAS-SMIF and Open Cassette load port addresses 200mm fab requirements for low operational costs, and cleanliness. TDK uses a 300mm bolts interface to allow installation using current EFEM design. TDK 200mm SMIF and 200mm Open Cassette design use a base 300mm load port and 300mm tool software interface. TDK Options include CID, wafer mapping, and ethernet.

About TDK Corporation

TDK Corporation is a leading electronics company based in Tokyo, Japan. It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK's comprehensive portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices, magnetic heads and more. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK focuses on demanding markets in the areas of information and communication technology and automotive, industrial and consumer electronics. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2019, TDK posted total sales of USD 12.5 billion and employed about 105,000 people worldwide.

Contacts

TDK Corporation of America
Mrs. Sara M. Lambeth, +1 972-409-4519
sara.lambeth@us.tdk.com

Release Summary

TDK will present the latest in load port and flip chip technology at Booth 1926 in the South Hall at the SEMICON West Conference.

Contacts

TDK Corporation of America
Mrs. Sara M. Lambeth, +1 972-409-4519
sara.lambeth@us.tdk.com