Flexible Printed Circuit Boards - Global Strategic Business Report Analysis 2016-2018 to 2024 - Flex-to-Fit Approach Opens New and Exciting Opportunities - ResearchAndMarkets.com

DUBLIN--()--The "Flexible Printed Circuit Boards - Global Strategic Business Report" report has been added to ResearchAndMarkets.com's offering.

The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2016 through 2024. Also, a five-year historic analysis is provided for these markets.

This report analyzes the worldwide markets for Flexible Printed Circuit Boards in US$.

The Global market is further analyzed by the following End-Use Segments:

  • Automotive
  • Consumer Electronics
  • Industrial
  • Others

The report profiles 199 companies including many key and niche players such as:

  • 3M Company (USA)
  • BHflex Co. Ltd. (South Korea)
  • Career Technology (MFG.) Co. Ltd. (Taiwan)
  • Daeduck GDS Co. Ltd. (South Korea)
  • Flexcom Inc. (South Korea)
  • Flexium Interconnect Inc. (Taiwan)
  • Fujikura Ltd. (Japan)
  • Ichia Technologies Inc. (Taiwan)
  • Interflex Co. Ltd. (South Korea)
  • MFS Technology (Singapore)
  • Multi-Fineline Electronix Inc. (MFLEX) (USA)
  • Newflex Technology Co. Ltd. (South Korea)
  • Nippon Mektron Ltd. (Japan)
  • Nitto Denko Corporation (Japan)
  • SIFlex Co. Ltd. (South Korea)
  • Sumitomo Electric Industries Ltd. (Japan)
  • Xiamen Hongxin Electron-Tech Co. Ltd. (China)
  • Zhen Ding Technology Holding Limited (ZDT) (Taiwan)

Key Topics Covered

1. Industry Overview

2. Market Trends and Growth Drivers

  • Inherent Product Advantages Fuel Market Growth
  • Key Benefits of Flexible Circuits
  • Superior Packaging Flexibility
  • Key Attribute of FPCs Expanding Applications Market
  • Circuit Designing Evolves as End Product Developers Seek Miniaturization
  • Thinner Materials Witness Tremendous Adoption to Realize Smaller Geometries
  • Flex-to-Fit Approach Opens New and Exciting Opportunities
  • Customer Requirements Drive Innovations for Substrate Manufacturers
  • New Designing Tools Improve Competitiveness of Rigid-Flex Circuits
  • Key to High-Frequency Application
  • Increasing Laminate Material Choice Poses Fabrication Challenges; Additives Comes to Rescue
  • Stretchable Circuits Garner Significant Interest as Novel Interconnection Alternative
  • Material and Design Advancements Enable Stretchable Interconnects in Flexible Circuits
  • Recent Technological Advances in Flex Circuits
  • New Technology Takes Flexible Circuits to New Level
  • Technological Advances thwart Material Limitations for Transparent Flex Circuits
  • Super-Thin Nanoscale Circuits Promise Tremendous Computing Power, Open New Design Possibilities
  • Chemically Doped Nanotubes Emulate Silicon Circuits in Handling Power Fluctuations

3. Application Markets

4. Product Overview

5. Product Launches/Introductions

6. Recent Industry Activity

7. Focus on Select Global Players

8. Global Market Perspective

Total Companies Profiled: 199 (including Divisions/Subsidiaries - 214)

The United States (61)

Canada (6)

Japan (10)

Europe (65)

  • France (4)
  • Germany (21)
  • The United Kingdom (18)
  • Italy (6)
  • Rest of Europe (16)

Asia-Pacific (Excluding Japan) (69)

Middle East (3)

For more information about this report visit https://www.researchandmarkets.com/research/bdmnv7/flexible_printed?w=4

Contacts

ResearchAndMarkets.com
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
Related Topics: Printed Electronics

Contacts

ResearchAndMarkets.com
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
Related Topics: Printed Electronics