X-Class CMOS Image Sensor Platform from ON Semiconductor Enables New Functionality for Industrial Camera Design

High-speed 12 megapixel and 4k / UHD devices are first in compatible family

PHOENIX--()--ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has announced its X-Class image sensor platform, which allows a single camera design to support not only multiple product resolutions, but also different pixel functionality. The first devices in the new platform are the 12 megapixel (MP) XGS 12000 and 4k / UHD resolution XGS 8000 image sensors, which provide high-performance imaging capabilities for applications such as machine vision, intelligent transportation systems and broadcast imaging.

The X-Class image sensor platform enables a new dimension in camera design by supporting multiple CMOS pixel architectures within the same image sensor frame. This allows a single camera design not only to support multiple product resolutions, but also different pixel functionality, such as larger pixels that trade resolution at a given optical format for higher imaging sensitivity, designs optimized for low noise operation to increase dynamic range and more. By supporting these different pixel architectures through a common high bandwidth, low power interface, camera manufacturers can leverage existing parts inventory and accelerate time to market for new camera designs.

The initial devices in the X-Class family, the XGS 12000 and XGS 8000, are based on the first pixel architecture to be deployed in this platform – an advanced 3.2 µm global shutter CMOS pixel that features superior imaging performance, high image uniformity and low noise. The XGS 12000 provides 12 MP (4096 x 3072 pixel) resolution in a one-inch optical format to supply the imaging detail and performance needed for modern machine vision and inspection applications. The device is planned to be available in two speed grades – one that fully utilizes 10GigE interfaces by providing full resolution speeds up to 90 frames per second (fps), and a lower price version providing 27 fps at full resolution that aligns with the bandwidth available from USB 3.0 computer interfaces. The XGS 8000 provides 4k / UHD (4096 x 2160 pixels) resolution in a 1/1.1 inch optical format and is also planned to be available in two speed grades (130 and 75 fps), making the device ideal for broadcast applications.

The package dimensions of both devices combine with a low thermal profile enabled by the low-voltage, low-power architecture of the X-Class interface to make them fully compatible with compact 29 x 29 mm2 camera designs.

“As the needs of industrial imaging applications such as machine vision inspection and industrial automation continue to advance, the design and performance of the image sensors targeting this growing market must continue to evolve,” said Herb Erhardt, Vice President and General Manager, Industrial Solutions Division, Image Sensor Group at ON Semiconductor. “With the X-Class platform and devices based on the new XGS pixel, end users have access to the performance and imaging capabilities they need for these applications, while camera manufacturers have the flexibility they require to develop next-generation camera designs for their customers both today and in the future.”

The XGS 12000 and XGS 8000 will begin sampling in the 2Q2018, with production availability scheduled for the 3Q2018. Both devices will be available in 163-pin LGA packages in monochrome and color configurations. Additional devices based on the 3.2 µm XGS pixel, as well as products based on other pixel architectures, are planned for the X-Class family in the future.

To help customers in the development of new camera designs incorporating the new image sensors, ON Semiconductor offers evaluation kits that support full device evaluation, including still image and video capture, and region of interest readout. Other custom test functions can also be configured. Customers can purchase an evaluation kit or enquire about an on-site demonstration of X-Class devices by contacting their local ON Semiconductor sales representative.

About ON Semiconductor

ON Semiconductor (Nasdaq: ON) is driving energy efficient innovations, empowering customers to reduce global energy use. The company is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient, power management, analog, sensors, logic, timing, connectivity, discrete, SoC and custom devices. The company’s products help engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical, aerospace and defense applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, a robust compliance and ethics program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe and the Asia Pacific regions. For more information, visit http://www.onsemi.com.

ON Semiconductor and the ON Semiconductor logo are registered trademarks of Semiconductor Components Industries, LLC. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders. Although the company references its website in this news release, information on the website is not to be incorporated herein.

Contacts

ON Semiconductor
Veronika Holscher, 408-660-2688
Corporate Public Relations
veronika.holscher@onsemi.com
or
Parag Agarwal, 602-244-3437
Vice President Investor Relations and Corporate Development
parag.agarwal@onsemi.com

Contacts

ON Semiconductor
Veronika Holscher, 408-660-2688
Corporate Public Relations
veronika.holscher@onsemi.com
or
Parag Agarwal, 602-244-3437
Vice President Investor Relations and Corporate Development
parag.agarwal@onsemi.com