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Dickey's Barbecue Pit Launches New Pickle-Flavored Menu Items Across Canada

CALGARY, Alberta--(BUSINESS WIRE)--Dickey's Barbecue Pit is giving Canadian pickle lovers something to relish with the launch of five all-new, limited-time menu items bursting with bold, tangy flavor in every bite. From dill-dusted favorites to crave-worthy barbecue creations, the world's largest barbecue brand is serving up a fresh twist on authentic Texas barbecue as it continues growing its presence across Canada. New Pickle Menu Offerings: Now this is a big dill. Available now at participat...
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Eurofins Scientific SE: Weekly Report on Share Repurchases from 07th September to 11th September 2026

LUXEMBOURG--(BUSINESS WIRE)--Regulatory News: Eurofins Scientific SE (Paris:ERF): Name of the Issuer Identify code of the Issuer Transaction day Identify code of the financial instrument Total daily volume (in number of shares) Daily weighted average purchase price of the shares Market (MIC Code) EUROFINS SCIENTIFIC 529900JEHFM47DYY3S57 07/09/2026 FR0014000MR3 35 000 71.5934 XPAR EUROFINS SCIENTIFIC 529900JEHFM47DYY3S57 07/09/2026 FR0014000MR3 15 000 71.5662 CEUX EUROFINS SCIENTIFIC 529900JEHFM...
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First Trust Global Funds PLC UK Regulatory Announcement: Net Asset Value(s)

LONDON--(BUSINESS WIRE)--  Funds Date TIDM ISIN Code Shares in Issue Currency Net Asset Value NAV/per Share First Trust Vest U.S. Equity Moderate Buffer UCITS ETF - May 11.09.2026 GMAY.LN IE000P0FL8E3 1,350,002.00 USD  54,918,444.48   40.680  ...
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Deutsche Bank AG UK Regulatory Announcement: Issuance of Securities 

LONDON--(BUSINESS WIRE)--  DB ETC PLC Dated: 14 September 2026 COMPANY ANNOUNCEMENT Immediate Release 14 September 2026 DB ETC plc (the Issuer) Law 1991 (as amended) with registered number 103781) Re: Issuance of ETC Securities Announcement The Issuer has agreed to issue ETC Securities for the following Series as set out in the table below. Series Tranche Number of Securities to be issued Trade Date Settlement Date ISIN: Series 09 - Xtrackers Physical Gold ETC (EUR)   707 1,700 10 September 202...
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Ascent Developer Solutions Announces $3.7B in Loan Originations, Expansion of Los Angeles Headquarters

LOS ANGELES--(BUSINESS WIRE)--Ascent Developer Solutions Announces $3.7B in Loan Originations, Expansion of Los Angeles Headquarters...
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Deutsche Bank AG UK Regulatory Announcement: Value per Security

LONDON--(BUSINESS WIRE)--  DB ETC PLC Dated: 14 September 2026 COMPANY ANNOUNCEMENT Immediate Release 14 September 2026 DB ETC plc (the Issuer) (incorporated and registered in Jersey under the Companies (Jersey) Law 1991 (as amended) with registered number 103781) Re: Value per Security of ETC Securities Announcement The Issuer is providing the Value per Security for the ETC Securities for the following Series as set out in the table below for 11 September 2026 Series ISIN Currency Value per Se...
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Rajant Acquires The Bellwether Group to Advance Mission-Ready Capabilities for National Security

MALVERN, Pa.--(BUSINESS WIRE)--Rajant acquires The Bellwether Group, combining advanced technology and mission expertise to expand mission-ready capabilities for national security....
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Terminal X Brings AI Memory System to Alternative Asset Managers with OpenAI

NEW YORK--(BUSINESS WIRE)--Terminal X and OpenAI bring frontier AI to private markets, enabling alternative asset managers to encode proprietary investment judgment into AI....
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Hirebotics Expands Cobot Reach and Flexibility with New Line Tracking and Linear Rail Capabilities at IMTS

CHICAGO--(BUSINESS WIRE)--Hirebotics today unveiled new extensions to its collaborative robot (cobot) systems that enable manufacturers to paint moving parts and reach large, difficult-to-handle materials and assemblies without changing existing workflows. Line tracking for Hirebotics’ Cobot Painter and modular linear rail capabilities for its family of cobot systems extend the working range of the cobots, giving manufacturers greater flexibility to automate conveyor-based finishing operations...
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 Lorentz Solution Jointly Presents with NVIDIA on Automated Large-Scale Chip-Level 3D EM Extraction and Sign-off of Ultra-High-Speed Silicon Photonics and IC/3DIC Designs at 2026 TSMC OIP

SANTA CLARA, Calif.--(BUSINESS WIRE)--Lorentz Solution, Inc., the world's leading provider of 3D electromagnetic (EM) design platforms for IC, 3DIC, and advanced packaging, today announced that it is jointly presenting with NVIDIA at the TSMC 2026 Open Innovation Platform (OIP) Ecosystem Forum, to be held on Sept 23, 2026 in Santa Clara, CA. Their paper, "Large-scale Chip-level 3D EM Extraction and Sign-off of Ultra-high-speed Silicon Photonics and Custom Silicon IC/3DIC Designs with PeakView®,...