Credo to Showcase High-Speed Connectivity Solutions for AI Infrastructure at the 2025 OCP Global Summit

SAN JOSE, Calif.--(BUSINESS WIRE)--Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing secure, high-speed connectivity solutions that deliver improved reliability and energy efficiency, will highlight its technologies and vision for easing system bandwidth bottlenecks in next-generation AI infrastructure at the 2025 OCP Global Summit. Credo will demonstrate the company’s latest optical, PCI Express^® (PCIe^®) and active electrical cable (AEC) product portfolio at the Summit expo, and Credo executives will share high-speed connectivity advancements through ecosystem collaboration during presentations at the conference. The OCP Global Summit takes place October 13-16 at the San Jose Convention Center.

Credo Booth (B23) Demonstration Highlights:

• ZeroFlap Optical Modules: Optical modules with built in telemetry, in-band messaging and diagnostics to enable breakthrough improvements in optical reliability
• ZeroFlap AECs: 1.6T 224G per lane AECs that deliver zero link flaps to support the lossless backend RDMA network that AI clusters are built on
• Rubin Ultra NVL576 “Kyber” rack fully cabled with 1.6T ZeroFlap AECs
• Bluebird DSPs: 224Gbps PAM4 data transmission with superior power efficiency and ultra-low latency allowing 1.6T transceivers to consume well under 20W
• Lark 850 DSPs: power 800G transceivers that consume less than 10W of power
• Toucan PCIe Gen6 retimers: deliver 40dB reach and sub 7ns latency at 11W to extend PCIe trace lengths between root-complex and endpoint devices such as GPUs, SmartNICs, NVMe SSDs, and CXL memory
• PILOT telemetry platform: enables rapid system bring-up, deep visibility into link behavior, and predictive insight into signal integrity issues—before they become system-level failures

Innovation Village Demonstration:

• Rubin NVL144 Cluster fully cabled with 1.6T ZeroFlap AECs

Presentations:

• Executive Session: The Path to Zero Flap: Reinventing Optical Reliability for Scalable AI Clusters
  Tuesday, October 14 at 1:15 p.m. in room 211 (Concourse Level)
  Speakers: Bill Brennan, President and CEO, Credo and Stephen Manley, Senior Principal Network Engineer, Oracle Cloud
• Expo Session: Wired for Success: Enhancing AI Cluster Reliability with Copper Cables
  Tuesday, October 14 at 4:20 p.m. in the Expo Hall Theater (Concourse Level)
  Speaker: Ameet Suri, AVP of Product, AECs, Credo

To request a meeting or product demo, please contact [e-mail].

About Credo

Credo’s mission is to redefine high-speed connectivity by delivering breakthrough solutions that enable the next generation of AI-driven applications. We are committed to enabling faster, more reliable, more energy-efficient, and scalable solutions that support the ever-expanding demands of AI, cloud computing, and hyperscale networks. Our innovations ease system bandwidth bottlenecks while simultaneously improving on power, security, and reliability. Our connectivity solutions are optimized for optical and electrical Ethernet applications, including the emerging 100G (or Gigabits per second), 200G, 400G, 800G and the emerging 1.6T (or Terabits per second) port markets. Credo products are based on our proprietary Serializer/Deserializer (SerDes) and Digital Signal Processor (DSP) technologies. Our product families include Integrated Circuits (ICs) for the optical and line card markets, Active Electrical Cables (AECs) and SerDes Chiplets. Our intellectual property (IP) solutions consist primarily of SerDes IP licensing.

For more information, please visit https://www.credosemi.com. Follow Credo on LinkedIn.

Credo and the Credo logo are registered trademarks of Credo Technology Group Limited in the United States and other areas. All other trademarks referenced herein are the property of their respective owners.