-

OIF Announces 2024-2025 Board of Directors and Officers

FREMONT, Calif.--(BUSINESS WIRE)--OIF, where the optical networking industry’s interoperability work gets done, today announced its newly elected 2024-2025 Board of Directors and Officers. The new terms began on Oct. 1, 2024.

2024-2025 Election Results

  • Board of Directors:
  • Ian Betty, Ciena, was re-elected to the Board
  • Mike Klempa, Alphawave Semi, was elected to the Board and continues as Physical and Link Layer (PLL) Interoperability Working Group Chair
  • Mike Li, Intel, was re-elected to the Board
  • Cathy Liu, Broadcom Inc., was re-elected to the Board and continues to serve as Vice President
  • David Stauffer, Kandou Bus, was elected to the Board and continues to serve as PLL Working Group Chair
  • Continuing to serve on the Board:
  • Nathan Tracy, TE Connectivity, continues to serve as President
  • Jeff Hutchins, Ranovus, will serve as Secretary/Treasurer and continues as PLL Working Group – Energy Efficient Interfaces (EEI) Vice Chair
  • Dave Brown, Nokia, continues to serve as Director of Communications
  • Officers
  • Karl Bois, Nvidia, was re-elected as Technical Committee Chair
  • Tom Issenhuth, Huawei Technologies, was re-elected as Market Awareness & Education Committee Co-Chair, PLL
  • Sam Kocsis, Amphenol Corporation, was elected as Technical Committee Vice Chair

“Congratulations to OIF’s Board of Directors and Officers,” said Nathan Tracy, President of OIF. “As a volunteer organization, OIF relies on the dedication and expertise of its members to advance optical networking interoperability. Their willingness to contribute their time and talent is invaluable, and I am proud to be a part of such a committed and visionary group.”

For more information about OIF and its leadership, visit OIF’s website.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and http://www.oiforum.com.

Contacts

Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010

OIF


Release Versions

Contacts

Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010

More News From OIF

OIF Validates AI-Era Interoperability Live at ECOC 2026 Through Multi-Vendor Demonstrations and Expert Sessions

FREMONT, Calif.--(BUSINESS WIRE)--OIF will bring together 39 of its member companies at the ECOC 2026 Exhibition, September 21–23 in Malaga, Spain, to showcase the interoperable building blocks required to scale AI-era networks. Through live, multi-vendor demonstrations at booth #2126, OIF members will show how industry collaboration translates specifications into working implementations across optical systems, high-speed electrical interfaces, module management, co-packaging and energy-efficie...

OIF Brings Industry-Wide Interoperability to Life at ECOC 2026, Accelerating Scalable, Efficient Networks for the AI Era

FREMONT, Calif.--(BUSINESS WIRE)--OIF, where the optical networking industry’s interoperability work gets done, today announced its live, multi-vendor interoperability demonstration for the ECOC 2026 Exhibition being held September 21 - 23 in Malaga, Spain. Featuring 39 participating member companies in booth 2126, the demonstration showcases how open interoperability is helping the industry transition next-generation optical networking technologies, from specification to real-world deployment...

OIF Q2 Meeting Advances Management for Path Startup, Encryption, Near-Package Optics and High-Density Connector Interfaces

FREMONT, Calif.--(BUSINESS WIRE)--OIF today announced three new project starts, the release of Common Management Interface Specification (CMIS) 5.4 and approval to publish the Energy Efficient Interfaces (EEI) High-Density (HD) Connector Framework following its Q2 2026 Technical and MA&E Committees Meeting, held May 18–21 in St Julian’s, Malta. The meeting convened more than 175 member company representatives to tackle interoperability needs emerging at the intersection of higher lane rates...
Back to Newsroom