-

OIF Leads the Charge for Interoperability at ECOC 2024

34 Member Companies to Showcase Cutting-Edge Solutions, OIF Experts to Speak in Three Market Focus Sessions

FREMONT, Calif.--(BUSINESS WIRE)--OIF today unveiled new details on its live interoperability demonstrations at ECOC 2024, highlighting advancements across critical areas such as 800ZR, 400ZR and multi-span optics; Common Electrical I/O (CEI) CEI-112G and CEI-224G; Common Management Interface Specification (CMIS) and Energy Efficient Interfaces (EEI) & Co-Packaging.

The demonstrations showcased in Booth #B83 Sept. 23-25 in Frankfurt, Germany, feature collaboration among 34 member companies and highlight the organization’s leadership in interoperability across a range of cutting-edge technologies.

In addition to the demonstrations, OIF experts will lead Market Focus Sessions on Coherent Optics, CMIS and EEI.

“Live interoperability demonstrations are essential for the industry to witness firsthand the seamless integration of technologies,” said Dave Brown, OIF Director of Communications, and Nokia. “OIF’s demos at ECOC, featuring contributions from system, component and test-equipment vendors, underscore OIF’s leadership in interoperability across key technologies that are crucial in shaping the standards that will define the next decade of our industry.”

Interoperability Demonstrations at Booth #B83

800ZR, 400ZR and Multi-Span Optics – Unveiling Optical Breakthroughs: The pluggable coherent optics demonstration will showcase progress in the latest advancements in 800ZR, 400ZR and ZR+ optics interoperability, offering a comprehensive view of their capabilities and applications. The demo highlights include the first public 800ZR multivendor DSP interop; OpenZR+, 100ZR and OpenROADM/ITU-T, all over multiple, multi-span networks; and OIF’s foundational 400ZR collocated on the same single-span network as 800ZR.

CEI-112G-Linear & CEI-224G Interoperability – Fast-Track to the Future: OIF is accelerating electrical interface interoperability with a suite of 224Gbps and 112Gbps CEI multi-vendor demonstrations spanning a variety of applications that form the foundation of next-generation optical connectivity. The CEI-224G demonstrations include a diversity of link types from Very Short Reach (VSR) to Long Reach (LR) and linear interfaces leveraging specifications spearheaded by the OIF. The CEI-112G demonstration displays the breadth and depth of linear pluggable optics with interoperability from multiple vendors over various link types.

CMIS – Path to Plug & Play: OIF members will demonstrate physical layer management interoperability across diverse network equipment and pluggables enabled by CMIS. The demonstration includes the CMIS industry-standard management interface for a common network control platform, showing interoperability among different plug types, switches/routers and test-measurement equipment, all operating with CMIS.

EEI and Co-Packaging – Revolutionizing Connectivity: OIF members will display a conceptual demo of AI compute and live PCIe optical links, all using next-generation EEI, as well as live demos showcasing the latest advancements for ELSFP, external laser source faceplate pluggable, for co-packaging.

Participating member companies include:

Adtran, Alphawave Semi, Amphenol, Anritsu, AOI, Astera Labs, Cadence Design Systems Inc., CICT/Accelink, Cisco, Coherent Corp., EXFO, HG Genuine, Hisense, Infinera, Innolight, Juniper Networks, Keysight Technologies, Lessengers, Linktel Technologies, Lumentum, MACOM Technology Solutions, Marvell, Molex, MultiLane, Nokia, O-Net Technologies, Samtec, Semtech, Senko Advanced Components, Sumitomo Electric Industries, Synopsys, TE Connectivity, US Conec and Wilder Technologies.

OIF Experts to Share Insights in Market Focus Sessions

In addition to the live interoperability demonstrations, OIF experts will contribute their knowledge in three Market Focus Sessions, offering insights into key industry trends and technological advancements:

  • “Coherent Optics in the Datacenter”
    Monday, Sept. 23, 2024, from 1:20 pm-1:35 pm CEST
    Presenter: Karl Gass, OIF Physical and Link Layer (PLL) Working Group (WG) Optical Vice Chair
  • “CMIS – Is Plug-and-Play Possible?”
    Monday, Sept. 23, 2024, from 2:20 pm-2:35 pm CEST
    Presenter: Doug Cattarusa, OIF Editor, Cisco
  • “Energy Efficient Interfaces for the Next Generation of AI Compute”
    Tuesday, Sept. 24, 2024, from 11:20 am-11:35 am CEST
    Presenter: Jeff Hutchins, OIF Board Member and PLL WG EEI Vice Chair, Ranovus

For further details, please visit: https://www.oiforum.com/meetings-events/oif-ecoc-2024/

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at https://www.oiforum.com/.

Contacts

Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010

More News From OIF

OIF Announces 2026 Board of Directors and Officers

FREMONT, Calif.--(BUSINESS WIRE)--OIF, where the optical networking industry’s interoperability work gets done, today announced its 2026 Board of Directors and Officers. The updated leadership team will help steer OIF’s technical direction and industry collaboration as demand grows for higher-speed, lower-power interconnect solutions supporting AI, cloud and carrier networks. Terms run through Sept. 30, 2026. 2026 Leadership Board of Directors Nathan Tracy, TE Connectivity, was re-elected to th...

OIF Publishes Implementation Agreement for 112 Gb/s Retimed Transmitter Linear Receiver (RTLR) Electrical and Optical Interface Advancing Energy Efficiency

FREMONT, Calif.--(BUSINESS WIRE)--OIF, where the optical networking industry’s interoperability work gets done, today announced the publication of a new Implementation Agreement (IA) — OIF-EEI-112G-RTLR (Retimed Transmitter Linear Receiver). The new IA defines a high-speed, energy-efficient 112 Gb/s chip-to-module electrical interface that connects retimed optical transmitters with linear optical receivers, sometimes referred to as ‘half retimed optical links.’ It supports Ethernet C2M 100 Gb/s...

OIF Advances Industry Collaboration at Q4 2025 Meeting in Busan; Releases Foundational CEI-448G Framework Defining Next-Generation Electrical Interfaces

FREMONT, Calif.--(BUSINESS WIRE)--OIF convened its Q4 2025 Technical and MA&E Committees Meeting in Busan, South Korea, Nov. 3–7, where global members gathered to advance the organization’s work across optical, electrical, management and energy-efficient interfaces and took a decisive step toward enabling the next generation of high-speed interconnects with the release of the Next Generation CEI-448G Framework Document. Held fully in-person and exclusive to members, the Busan meeting drew m...
Back to Newsroom