-

Teledyne Announces Second Quarter 2024 Earnings Webcast Details

THOUSAND OAKS, Calif.--(BUSINESS WIRE)--Teledyne Technologies Incorporated (NYSE:TDY) will hold a conference call to discuss its second quarter 2024 results on Wednesday, July 24, 2024, at 8:00 a.m. Pacific. A press release with the second quarter financial results will be issued before the opening of the New York Stock Exchange on Wednesday, July 24, 2024.

To access the call, go to www.teledyne.com/investors/events-and-presentations approximately ten minutes before the scheduled start time. A replay will be available at this website for approximately one month starting at 9:00 a.m. Pacific on Wednesday, July 24, 2024.

Teledyne Technologies is a leading provider of sophisticated digital imaging products and software, instrumentation, aerospace and defense electronics, and engineered systems. Teledyne’s operations are primarily located in the United States, Canada, the United Kingdom, and Western and Northern Europe. For more information, visit Teledyne’s website at www.teledyne.com.

Contacts

Jason VanWees
(805) 373-4542

Teledyne Technologies Incorporated

NYSE:TDY

Release Versions

Contacts

Jason VanWees
(805) 373-4542

More News From Teledyne Technologies Incorporated

Teledyne to Demonstrate Integrated RF, Microwave and Sensing Capabilities at International Microwave Symposium 2026

THOUSAND OAKS, Calif.--(BUSINESS WIRE)--Teledyne Technologies Incorporated (NYSE:TDY) brings together a wide range of RF and microwave products and capabilities, including high-performance semiconductors, components, modules and interconnects, signal and power switching, and thermal imaging, at the International Microwave Symposium, June 9 to 11, in Boston. Visitors to Booth 19076 will see how Teledyne's integrated portfolio addresses the full signal chain across communications, radar, and elec...

Teledyne FLIR OEM Launches Boson SX8, the First NDAA-Compliant 8 µm SXGA LWIR Thermal Camera Module

GOLETA, Calif.--(BUSINESS WIRE)--Teledyne FLIR OEM, a business unit of Teledyne Technologies Incorporated, announced the release of the ITAR-free Boson® SX8, the first NDAA-compliant, volume production, uncooled longwave infrared (LWIR) thermal camera module to combine an 8-micron pixel pitch with SXGA (1280 × 1024) resolution. The state-of-the-art 8-micron pixel enables industry-best thermal performance and four times the resolution of today’s high-volume, uncooled VGA (640 × 512) thermal camer...

Teledyne HiRel Semiconductors Unveils Space-Screened, Ultra-Low Power 4 GHz Wideband Low Noise Amplifier

GARLAND, Texas--(BUSINESS WIRE)--Teledyne HiRel Semiconductors, a business unit of Teledyne Technologies Incorporated (NYSE:TDY) and a leading supplier of high-reliability RF and microwave solutions, announced the TDLNA0840SEP, a space-screened, ultra-low-power, wideband low-noise amplifier (LNA) designed to support the growing demands of satellite constellations in low Earth orbit (LEO) and medium Earth orbit (MEO), spaceborne communications and advanced RF front-end architectures. Building on...
Back to Newsroom