-

JEDEC Board Selects Samsung Memory Business President as Recipient of its 2022 Distinguished Executive Leadership Award

ARLINGTON, Va.--(BUSINESS WIRE)--The JEDEC Board of Directors passed a resolution yesterday at its November board meeting naming Jung-Bae Lee, Ph.D. and president of the Memory Business at Samsung Electronics, as the recipient of its Distinguished Executive Leadership Award for 2022. The resolution passed unanimously.

“Jung-Bae Lee is one of the brightest minds in the semiconductor industry,” said Desi Rhoden, Executive Vice President at Montage Technology and JEDEC Memory Committee Chair. “Dr. Lee is the ultimate example of the type of leader for which the JEDEC Distinguished Executive Leadership Award was created to honor and recognize.”

Dr. Lee has worked in the Memory business for more than 30 years, in areas including DRAM product development, product planning, quality assurance and DRAM design. He has contributed much to the development and commercialization of products such as low power mobile DRAM, high-speed DRAM for servers, datacenter solid state drives and future technologies such as HBM-PIM and CXL memory that are breaking through the limitations of existing memory.

In addition, Lee personally holds more than 300 patents pertaining to technology innovation and to processes involving critical aspects of memory functionality. Many of his memory design innovations are now used in devices important to virtually every computing platform, including those in the desktop, mobile and mainframe environments.

From 1998 to 2001, Lee represented Samsung at JEDEC on standards-setting committees that were responsible for the establishment of the earliest SDRAM standards, including DDR, LPDDR and GDDR, followed by DDR2 and DDR3.

“Jung-Bae has long been an ardent supporter of the role of JEDEC and a true visionary who has contributed much to the growth of the semiconductor industry,” said K. C. Chen, co-founder of Wintec Industries Inc., and JEDEC Board Member. “Over the years, he has enabled a high degree of industry accord concerning DRAM and Flash standards, through his extensive technical knowledge, his personal commitment and the leadership roles he has held at Samsung,” he added.

“I have known JB for many years from shortly after his college years to the present day, and am continually humbled by his depth of familiarity with the industry, his understanding of the importance of standards and his dedication to excellence,” said JEDEC Chairman of the Board Mian Quddus.

Lee has been president of the Samsung Memory Business for the past 11 months. Prior to that, he oversaw all Samsung DRAM products and technology, from 2018 to 2020. As Samsung’s memory business chief, Lee is now responsible for all of the company’s memory products and technologies, worldwide.

He holds Bachelor of Science, Master of Science and doctorate degrees in Electronics Engineering from Seoul National University.

About JEDEC
JEDEC is the global leader in the development of standards for the microelectronics industry. Thousands of volunteers representing over 300 member companies work together in more than 100 JEDEC committees and task groups to meet the needs of every segment of the industry, manufacturers and consumers alike. The publications and standards generated by JEDEC committees are accepted throughout the world. All JEDEC standards are available for download from the JEDEC website. For more information, visit https://www.jedec.org/.

Contacts

Emily Desjardins
703-907-7560
emilyd@jedec.org

JEDEC


Release Summary
JEDEC names Jung-Bae Lee, Ph.D. and president of the Memory Business at Samsung Electronics as its Distinguished Executive Leadership Award recipient.
Release Versions

Contacts

Emily Desjardins
703-907-7560
emilyd@jedec.org

More News From JEDEC

JEDEC Prepares SPHBM4 Standard to Deliver HBM4-Level Throughput with Reduced Pin Count

ARLINGTON, Va.--(BUSINESS WIRE)--JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is nearing completion of a new standard for Standard Package High Bandwidth Memory (SPHBM4). SPHBM4 devices are similar to the HBM4 devices commonly used in artificial intelligence accelerators, using the same DRAM dies on a new interface base die which can be mounted on standard organic substrates. In contrast, HBM4 is typic...

JEDEC’s SOCAMM2: Low Power Compact LPDDR5X Modules Poised to Power Next-Gen AI Servers

ARLINGTON, Va.--(BUSINESS WIRE)--JEDEC® Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is nearing completion of JESD328: LPDDR5/5X Small Outline Compression Attached Memory Module (SOCAMM2) Common Standard, an upcoming standard for low-profile LPDRAM modules developed specifically for data center AI applications. When published, JESD328 is designed to provide a memory platform that delivers modular, low-power,...

JEDEC Announces Annual Update of DDR5 Serial Presence Detect (SPD) Contents Standard

ARLINGTON, Va.--(BUSINESS WIRE)--JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, has published the annual release of its JESD400-5D DDR5 Serial Presence Detect (SPD) Contents standard. This latest version 1.4 adds support for memory modules executing up to DDR5-9200 speeds, codes for the new Small Outline Compression Attached Memory Module (SOCAMM2) and expands error logging information for Multiplexed Rank Dual In-Line Mem...
Back to Newsroom