Global Die Attach Equipment Market Outlook (2018 to 2027) Featuring Panasonic, West-Bond & Hybond Among Others -

DUBLIN--()--The "Die Attach Equipment - Global Market Outlook (2018-2027)" report has been added to's offering.

The Global Die Attach Equipment market is expected to growing at a CAGR of 7.8% during the forecast period. Some of the key factors propelling the market growth include growing demand of ausn eutectic die-attach technology, increasing demand of discrete power devices, Rising demand for compact devices, and growing adoption of copper clips. However, dimensional changes during processing and service life and mechanical unbalance are restricting the market growth.

Die attach is a key process step in semiconductor packaging. It covers all devices across various applications and is a key contributor to assembly cost. The die attach equipment business will benefit from assembly and packaging opportunities created by the above-mentioned trends. This equipment can be classified into two categories: die bonders and flip-chip (FC) bonders. The die attach equipment offering includes multi-chip bonders for advanced packaging through market techniques such as epoxy, soft solder bonders, etc. to various applications such as Memory, RF & MEMS, LED, etc.

By application, light-emitting diode (LED) segment is expected to grow at a significant rate during the forecast period. Die attach material represents a key role in the performance and reliability of mid, high, and super-high power LEDs. With an increasing LED penetration rate, the demand for die-attach equipment is increasing. Eutectic gold-tin, silver-filled epoxies, solder, silicones, and the sintered materials have all been used for LED die attach.

On the basis of geography, Asia Pacific region is anticipated to witness considerable market growth during the forecast period, due to increasing number of IDMs (Integrated Device Manufacturer) in the region. The mass production of electronic products, which includes smartphones, wearables, and white goods, in China and Taiwan, makes use of several devices, such as optoelectronics, MEMS, and MOEMS. All these devices require die-attach equipment in the assembly process of these components. Furthermore, India is also witnessing growth in a number of smart cities, due to government initiatives and is expected to incorporate electronic solutions for purposes, such as surveillance, maintenance, monitoring, etc.

Companies Mentioned

  • Fasford Technology Co Ltd.
  • ASM Pacific Technology Limited
  • Inseto UK Limited
  • Kulicke and Soffa Industries, Inc.
  • Anza Technology Inc.
  • Be Semiconductor Industries N.V.
  • Palomar Technologies, Inc.
  • Dr. Tresky AG
  • Shinkawa Ltd.
  • Toray Engineering
  • MicroAssembly Technologies, Ltd.
  • DIAS Automation
  • Panasonic
  • West-Bond
  • Hybond

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2017, 2018, 2019, 2023 and 2027
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic analysis: Drivers and Constraints, Product/Technology Analysis, Porter's five forces analysis, SWOT analysis, etc.
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Key Topics Covered:

1 Executive Summary

2 Preface

2.1 Abstract

2.2 Stake Holders

2.3 Research Scope

2.4 Research Methodology

2.4.1 Data Mining

2.4.2 Data Analysis

2.4.3 Data Validation

2.4.4 Research Approach

2.5 Research Sources

2.5.1 Primary Research Sources

2.5.2 Secondary Research Sources

2.5.3 Assumptions

3 Market Trend Analysis

3.1 Introduction

3.2 Drivers

3.3 Restraints

3.4 Opportunities

3.5 Threats

3.6 Product Analysis

3.7 Application Analysis

3.8 Emerging Markets

3.9 Impact of Covid-19

4 Porters Five Force Analysis

5 Global Die Attach Equipment Market, By Bonding Technique

5.1 Introduction

5.2 Soft Solder

5.3 Hybrid Bonding

5.4 Epoxy

5.5 Eutectic

5.6 Sintering

5.7 Mass Reflow

5.8 Thermo-Compression Bonding (TCB)

5.9 Laser Assisted Bonding (LAB)

6 Global Die Attach Equipment Market, By Type

6.1 Introduction

6.2 Flip Chip Bonder

6.3 Die Bonder

7 Global Die Attach Equipment Market, By Application

7.1 Introduction

7.2 Logic

7.3 Optoelectronics / Photonics

7.4 RF & MEMS

7.5 Light-Emitting Diode (LED)

7.6 CMOS Image Sensor

7.7 Memory

7.7.1 DRAM

7.7.2 NAND

7.7.3 3D TSV Memory

7.8 Discretes

7.9 Integrated Device Manufacturers (IDMs)

7.10 Outsourced Semiconductor Assembly and Test (OSAT)

8 Global Die Attach Equipment Market, By Product Type

8.1 Introduction

8.2 12 Wafer Handling

8.3 8 Wafer Handling

8.4 6 Wafer Handling

9 Global Die Attach Equipment Market, By Geography

9.1 Introduction

9.2 North America

9.3 Europe

9.4 Asia Pacific

9.5 South America

9.6 Middle East & Africa

10 Key Developments

10.1 Agreements, Partnerships, Collaborations and Joint Ventures

10.2 Acquisitions & Mergers

10.3 New Product Launch

10.4 Expansions

10.5 Other Key Strategies

11 Company Profiling

For more information about this report visit

Laura Wood, Senior Press Manager
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900

Laura Wood, Senior Press Manager
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900