TOKYO--(BUSINESS WIRE)--Toshiba Memory Corporation, the world leader in memory solutions, today announced that it would begin sampling new JEDEC e-MMC Ver. 5.1 compliant embedded flash memory products utilizing BiCS FLASH™ 3D flash memory for consumer applications in the end of March.
e-MMC products are embedded flash memory products integrating flash memory chips and a controller in a single package.
The company will continue to reinforce its market-leading position by adding BiCS FLASH™ 3D memory embedded products to its lineup of flash memory products.
JEDEC e-MMC Ver. 5.1 standard
|Density||16GB, 32GB, 64GB, 128GB|
|Power Supply Voltage||
2.7 to 3.6V (Memory core)
|Bus Width||×1 / ×4 / ×8|
|Temperature Range||-25℃ to +85℃|
11.5mm × 13.0mm
Line-up of the New Products
|Product Name||Capacity||Package||Mass Production|
|THGAMRG7T13BAIL||16GB||11.5×13.0×0.8mm||3Q, 2019 (Jul.-Sep.)|
 One of the standard specifications of embedded flash memory defined by JEDEC. The new product also supports the command queuing and secure write protection functions which is specified as an option in JEDEC e-MMC Ver. 5.1.
 Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. For details, please refer to applicable product specifications.
* Company names, product names, and service names mentioned herein may be trademarks of their respective companies.
Toshiba Memory Corporation
Sales Planning Division
Information in this document, including product prices and specifications, content of services and contact information, is correct on the date of the announcement but is subject to change without prior notice.