Global Substrate-like PCB Market 2018-2022 | Communication Segment Dominates the Global Market | Technavio

Technavio has published a new market research report on the global substrate-like PCB market from 2018-2022. (Graphic: Business Wire)

LONDON--()--According to the latest market research report released by Technavio, the global substrate-like PCB market is expected to accelerate at a CAGR of over 7% during the forecast period. The need for miniaturization and more efficient interconnect solutions is one of the key factors triggering the growth of the market.

This research report titled ‘Global Substrate-like PCB Market 2018-2022’ provides an in-depth analysis of the market in terms of revenue and emerging market trends. It also includes an up-to-date analysis and forecasts for various market segments and all geographical regions.

This report is available at a USD 1,000 discount for a limited time only: View market snapshot before purchasing

The market research analysis categorizes the global substrate-like PCB market into the following applications:

  • Communication
  • IoT

In 2017, the communication segment accounted for 73.46% of the global market and is projected to reach 74.13% by 2022, exhibiting almost 0.67% increase in market share.

Global substrate-like PCB market: Top emerging trend

The increasing outsourcing of activities in the semiconductor industry is an emerging trend in the substrate-like PCB market. Previously, the semiconductor industry was characterized by the presence of companies that designed, fabricated, packaged, and tested ICs in-house, But, at present, many semiconductor companies are going fabless by only designing chips while outsourcing fabrication, packaging, and testing to other companies.

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Technavio’s sample reports are free of charge and contain multiple sections of the report including the market size and forecast, drivers, challenges, trends, and more.

Technavio’s report provides expert market research on the following topics:

Executive Report

  • Market Outline
  • Global Substrate-like PCB Market Overview

Market Insights

  • Market Sizing and Forecasts
  • Market Growth
  • Market Drivers and Challenges
  • Key Emerging Trends

Market Segmentation Analysis

  • Regional comparison (APAC, Americas, and EMEA)
  • Key leading countries
  • Market segmentation by application (communication and IoT)

Vendor Landscape

  • Vendor classification
  • Market positioning of vendors
  • Competitive scenario
  • Analysis of top vendors (AT&S, IBIDEN, Kinsus, Samsung Electro-Mechanics, Unimicron)

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 10,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

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Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200

Release Summary

According to the latest research report by Technavio, the global substrate-like PCB market is expected to accelerate at a CAGR of 7% until 2022.


Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200