DURHAM, N.C.--(BUSINESS WIRE)--Phononic, the company that is breaking the boundaries of semiconductor innovation to deliver cooling solutions with unprecedented performance and sustainability, today unveiled its proprietary Non-Hermetic Compatible Thermoelectric Cooler (TEC) Platform designed to provide high reliability and cooling performance, coupled with lower power consumption, for laser packaging. Building upon Phononic’s unique expertise in precision-cooled, solid state refrigeration and freezing technologies, this advancement brings to market a high-quality solution assured to meet both performance and reliability targets for sub-components within telecommunication and data center applications.
Most optical components manufacturers have experience in designing either cooled laser packages or non-hermetic laser packages. Phononic is uniquely positioned with experience in both of these areas. The company’s cooled, non-hermetic laser package design creates a pathway to large reductions in package costs.
“Optical components and module suppliers are under pressure to both rapidly innovate optical communications technology, and at the same time meet aggressive price points to keep up with competition,” said Vladimir Kozlov, founder and CEO of LIGHTCOUNTING, a leading optical communications market research company. “These trends have led to increased demand for more cost-effective sub-components.”
“Laser performance can be significantly hindered by environmental challenges inside laser packages,” said Kevin Granucci, general manager and vice president of sales, Phononic. “Humidity, condensation, corrosion, and even ice formation are all potential impediments that can degrade laser slope efficiency or increase coupling losses, which reduce data transmission rate, reach and the usable lifetime of a TOSA. Hermetic packaging to safeguard against these conditions has historically been challenging and expensive to implement. Non-hermetic laser packaging that not only overcomes reliability and cost obstacles, but is cooled as well, could greatly advance today’s optical communications technology, further accelerating the global transition to wireless 5G networks.”
This new non-hermetic TEC platform can be applied to a wide range of TEC designs and customers are encouraged to work with Phononic to create application-specific solutions. Phononic’s expert technical team offers a wealth of thermal design experience to facilitate rapid deployment of a non-hermetic laser package that is insulated from the performance and reliability risks of high humidity and heat. This support combined with Phononic’s innovative platform enables customers to avoid possible pitfalls early in the design cycle and optimize performance in even the most challenging of environments, without increasing power consumption or compromising performance for cost.
To learn more, visit https://phononic.com/optoelectronics/ or stop by Phononic’s booth (#5831) at The Optical Networking and Communication Conference & Exhibition (OFC) from March 11-15 in San Diego.
Phononic’s unrivaled approach to solid state cooling is breaking the boundaries of semiconductor innovation to deliver unprecedented performance and sustainability across the globe. From disrupting refrigeration and freezing, to cooling pinhead-sized fiber optics components, Phononic’s technology takes infinite forms to unseat the wasteful and unreliable cooling solutions of the past, which depend on bulky compressors, noisy fans and noxious gases simply not suited for the modern world. Phononic is transforming the way life-saving drugs and vaccines are protected, data is transmitted and food and beverages are sold, stored and transported. The company has been named to the 2016 and 2017 CNBC Disruptor 50 lists, received the US EPA’s 2017 Emerging Tech Award, R&D 100 Award and more. For more information visit www.phononic.com or follow us on Twitter @Phononic_Inc.