PISCATAWAY, N.J.--(BUSINESS WIRE)--IEEE, the world's largest technical professional organization dedicated to advancing technology for humanity, today announced that abstracts and proposals for professional development courses are due 9 October 2017 for the 2018 IEEE Electronic Components and Technology Conference (ECTC). ECTC is the flagship event of the IEEE Electronics Packaging Society (IEEE EPS), the leading international resource for technologists driving the research, design and development of revolutionary advances in electronic microsystem packaging and integration.
The world’s leading engineers and scientists in packaging, components and microelectronic systems annually gather at the IEEE ECTC event. The 29 May-1 June 2018 conference in San Diego, California, approaches as the electronics packaging industry is experiencing tremendous expansion and revolutionary change with innovations such as heterogeneous integration, three-dimensional (3D) packaging and the Internet of Things (IoT). To learn more about how to submit an abstract, please visit www.ectc.net.
New Society Name Better Represents Increasingly Diverse Fields of Interest
To better reflect this new reality of its technology space and the society’s increasingly important role as an unmatched repository of diverse microsystem packaging and integration expertise, the sponsoring society recently changed its name to the IEEE Electronics Packaging Society. IEEE EPS is showcasing its new name and logo at industry conferences, including the IEEE EPS-sponsored 2017 IEEE Holm Conference on Electrical Contacts, which takes place 10-13 September in Denver, Colorado.
“Packaging is becoming more and more strategically important across every aspect of the electronics industry, and IEEE ECTC is a crucial forum for technical exchange within an environment of cooperation,” said Jean Trewhella, president of IEEE EPS, formerly known as the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. “It used to be that the goal in microsystems packaging was to protect silicon devices and do no harm, but now it’s more that technologists in a growing range of industries look to packaging as a way to interconnect dissimilar chips for peak performance. There are a number of simultaneous trends across electronics that are contributing to this shift, and that’s why our society moved to a much broader name to better represent everything that is going on across the exploding Field of Interest that IEEE EPS serves.”
A key trend in electronics packaging is heterogeneous integration and its associated techniques, such as 3D stacking. Separately manufactured components are being integrated into higher-level assemblies that, in the aggregate, provide enhanced functionality and improved operating characteristics. Consequently, heterogeneous integration demands that engineers from disparate technology domains work together, in some cases for the first time, within the context of electronics packaging.
Another driver of change for electronics packaging is the IoT, as sensors and communications are being embedded into more and more devices and environments, which sometimes introduce unprecedented requirements for the reliability of microsystems. The impact of such trends on the electronics packaging industry is historic. Variant Market Research forecasts global growth of the market for 3D semiconductor packaging, for example, from $4 billion in 2016 to $12 billion by 2024 (a compounded annual growth rate of 15.2 percent over the period).1
IEEE EPS (https://eps.ieee.org) is positioned as the leading global authority on electronic packaging and integration. The society represents current and future technologists in the space, spanning every nuance from earliest-stage research, through design and prototyping, to assembly and manufacturing, and ultimately to ensuring safe and reliable operation. EPS is also increasingly serving as a focal point for credible information transfer and collaboration for other IEEE societies, as technologists in those technology areas seek to derive value from microsystem packaging.
IEEE ECTC’s technical program contains papers covering leading-edge developments across the packaging spectrum, addressing topics such as advanced packaging, applied reliability, assembly and manufacturing technology, components and radio frequency (RF), emerging technologies, interconnections, materials and processing, modeling and simulation and optoelectronics.
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