DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/slmhpv/flip_chipwlp) has announced the addition of the "Flip Chip/WLP Manufacturing and Market Analysis" report to their offering.
Flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computer peripherals. Wafer-level packaging (WLP), the fabrication of the package directly on the wafer, is experiencing exceptional growth and stands out as one of the bright growth areas in electronics today.
WLP offers lower cost, a smaller package, higher performance and added functionality compared to older methods. In the world of high-speed/high-performance IC and package design, flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computing.
This report examines the market for flip chip ICs, and the lithography and wet etch tools used in their manufacture.
Key Topics Covered:
Chapter 1 Introduction
Chapter 2 Executive Summary
Chapter 3 Flip Chip/WLP Issues and Trends
3.2 Wafer Bumping
3.3 Wafer Level Packaging
3.4 Pad Redistribution
3.5 Wafer Bumping Costs
Chapter 4 Lithography Issues And Trends
4.2 Exposure Systems
4.3 Competitive Technologies
Chapter 5 UBM Etch Issues And Trends
5.2 Technology Issues And Trends
5.3 Batch Versus Single-Wafer Etching
Chapter 6 Metallization Issues and Trends
6.2 Sputtering Metallization
Chapter 7 Market Analysis
7.1 Market Drivers For Flip Chip And WLP
7.2 Market Opportunities
7.4 Flip Chip Market
7.5 Lithography Market
7.6 Wet Etch Market
7.7 Deposition Market
For more information visit http://www.researchandmarkets.com/research/slmhpv/flip_chipwlp