-

Chiplet Summit Extends Nomination Deadline for 2026 Best of Show Awards

SANTA CLARA, Calif.--(BUSINESS WIRE)--Chiplet Summit, the premier global event focused on chiplet-based design and integration, has extended the nomination deadline to January 23, 2026, for its inaugural Best of Show Awards, debuting at Chiplet Summit 2026, February 17-19, at the Santa Clara Convention Center.

Built something game-changing? Prove it at Chiplet Summit 2026. Best of Show Awards deadline extended!

Share

The awards recognize breakthrough technologies advancing chiplet-based design and higher-performance computing. Categories include:

  • AI Accelerators – Next-generation engines improving AI/ML performance
  • Packaging and Substrates – Innovations in packaging, power, thermal management, and manufacturing
  • Connectivity and Interoperability – Technologies enabling seamless multi-die and multi-vendor systems

An independent panel of industry experts will judge entries based on innovation, technical merit, and industry impact. Submissions are open to Chiplet Summit 2026 sponsors and exhibitors, with winners announced live at the event.

Updated deadlines and submission details: https://chipletsummit.com/2026-best-of-show-awards/

About Chiplet Summit

Chiplet Summit, a product of Semper Technologies, is a technical conference and trade show that showcases the emerging chiplet market. The event features the innovators and companies using chiplets in designs for processors, memories, communications chips, and AI devices. For more information, visit www.chipletsummit.com.

Contacts

Media Contact:
Dan Chmielewski
Madison Alexander PR, Inc.
714-832-8716
C: 949-231-2965
dchm@madisonalexanderpr.com

Industry:

Chiplet Summit

Release Versions
English
Hashtags
#AdvancedPackaging
#BestOfShow
#ChipletSummit
#Chiplets
#Semiconductors
#TechAwards

Contacts

Media Contact:
Dan Chmielewski
Madison Alexander PR, Inc.
714-832-8716
C: 949-231-2965
dchm@madisonalexanderpr.com

Social Media Profiles
Follow us on LinkedIn!
More News From Chiplet Summit

Chiplet Summit Announces 2026 Best of Show Award Winners

SANTA CLARA, Calif.--(BUSINESS WIRE)--The fourth annual Chiplet Summit, the largest conference dedicated to chiplets, today reported on its 2026 Best of Show Awards at the Santa Clara Convention Center. The winners are: Siemens EDA for “Packaging: Design” – Their Innovator3D IC software enables fast planning and heterogeneous integration of ASICs and chiplets using 2.5D and 3D packaging technologies. UCIe Consortium for “Connectivity and Interoperability” – Their UCIe 3.0 specification delivers...

MIPS to Present Software-First Physical AI Design Insights at Chiplet Summit 2026

SANTA CLARA, Calif.--(BUSINESS WIRE)--Chiplet Summit, the industry’s largest chiplet event, today announced that MIPS, a GlobalFoundries company, will participate in Chiplet Summit 2026, February 17-19 at the Santa Clara Convention Center. Drew Barbier, VP Products at MIPS, will deliver a presentation titled “Safety-Critical Physical AI Applications Using RISC-V.” He will also be on the panel “Selecting the Right Chiplets for Your Edge Application.” In addition, Sam Grove, Head of Software and...

Silicon Catalyst Showcases the Next Wave of Chiplet Startups at Chiplet Summit 2026

SANTA CLARA, Calif.--(BUSINESS WIRE)--Chiplet Summit, the industry’s largest chiplet event, today announced a joint initiative with Silicon Catalyst, the world’s leading accelerator for semiconductor startups. The collaboration features a keynote and a marquee panel session at Chiplet Summit 2026, February 17-19, at the Santa Clara Convention Center. Silicon Catalyst COO Nick Kepler will deliver a special presentation, “Catalyzing Chiplet Startups,” on Wednesday, February 18, at 11:20 am. On Th...
Back to Newsroom