-

JEDEC Publishes New Standard to Support CXLTM Memory Module Implementation

ARLINGTON, Va.--(BUSINESS WIRE)--JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of JESD317: Compute Express Link (CXL™) Memory Module Base Standard, known as “CMM”. JESD317 CMM defines the specifications of interface parameters, signaling protocols, environmental requirements, packaging, and other features as reference for specific target implementations of CXL™-attached memory modules, and is available for free download from the JEDEC website.

CMM is designed to provide reference base targets for CXLTM-attached memory modules to help simplify system design and minimize industry confusion for first adoption. By leveraging established industry standard specifications from SNIA (EDSFF), PCIe, and CXLTM to define specific module implementations, CMM enables system providers to accommodate certain known devices while leaving room for innovation. The standard also supports system device slots designed to be compatible with both CMMs and traditional PCIe-attached NVMe drives. For a deeper dive, catch JEDEC’s session at FMS 2023 in Santa Clara, CA, on Wednesday, August 9th at 8:30AM: Breaking Past Expansion Limits: CXL-Attached Memory Standards.

“The high-speed memory capabilities offered by CXLTM memory modules are increasingly important to the industry and critical to many emerging applications such as artificial intelligence and data analytics,” said Mian Quddus, JEDEC Board of Directors Chairman. He added: “JEDEC’s goal with the development of JESD317 CMM is to offer suppliers of CXLTM -attached memory industry-aligned targets to support broader adoption.”

“JEDEC’s new CMM standard establishes a first common starting point for CXLTM memory expansion and lowers the barrier of technology adoption for both suppliers and system manufacturers,” noted Jonathan Hinkle, Chair of JEDEC’s CXL Memory Task Group. He added: “In a dedicated effort underscoring the importance of this standard for the industry, key companies joined forces in the TG to align and drive this first standard, including major hyperscale and enterprise system designers, memory suppliers, and processor vendors.”

About JEDEC

JEDEC is the global leader in the development of standards for the microelectronics industry. Thousands of volunteers representing over 350 member companies work together in more than 100 JEDEC committees and task groups to meet the needs of every segment of the industry, for manufacturers and consumers alike. The publications and standards generated by JEDEC committees are accepted throughout the world. All JEDEC standards are available for download from the JEDEC website. For more information, visit https://www.jedec.org.

Contacts

Emily Desjardins
emilyd@jedec.org
703-907-7560

JEDEC


Release Versions

Contacts

Emily Desjardins
emilyd@jedec.org
703-907-7560

More News From JEDEC

JEDEC Prepares SPHBM4 Standard to Deliver HBM4-Level Throughput with Reduced Pin Count

ARLINGTON, Va.--(BUSINESS WIRE)--JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is nearing completion of a new standard for Standard Package High Bandwidth Memory (SPHBM4). SPHBM4 devices are similar to the HBM4 devices commonly used in artificial intelligence accelerators, using the same DRAM dies on a new interface base die which can be mounted on standard organic substrates. In contrast, HBM4 is typic...

JEDEC’s SOCAMM2: Low Power Compact LPDDR5X Modules Poised to Power Next-Gen AI Servers

ARLINGTON, Va.--(BUSINESS WIRE)--JEDEC® Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is nearing completion of JESD328: LPDDR5/5X Small Outline Compression Attached Memory Module (SOCAMM2) Common Standard, an upcoming standard for low-profile LPDRAM modules developed specifically for data center AI applications. When published, JESD328 is designed to provide a memory platform that delivers modular, low-power,...

JEDEC Announces Annual Update of DDR5 Serial Presence Detect (SPD) Contents Standard

ARLINGTON, Va.--(BUSINESS WIRE)--JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, has published the annual release of its JESD400-5D DDR5 Serial Presence Detect (SPD) Contents standard. This latest version 1.4 adds support for memory modules executing up to DDR5-9200 speeds, codes for the new Small Outline Compression Attached Memory Module (SOCAMM2) and expands error logging information for Multiplexed Rank Dual In-Line Mem...
Back to Newsroom