Electronic Adhesives Market by Form, Resin, End-Use Industry, Product Type and Region - Global Forecast to 2027 - ResearchAndMarkets.com

DUBLIN--(BUSINESS WIRE)--The "Global Electronic Adhesives Market by Form (Liquid, Paste, Solid), Resin (Epoxy, Silicone, Acrylic), End-Use Industry (Communications, Computers, Consumer Electronics, Industrial, Medical), Product Type and Region - Forecast to 2027" report has been added to ResearchAndMarkets.com's offering.

The electronic adhesives market is projected to grow from USD 4.5 billion in 2022 to USD 6.1 billion by 2027, at a CAGR of 6.1% between 2022 and 2027.

The global electronic adhesives market is driven by the rising demand for advanced and sophisticated electronic devices. The use of electronic devices is increasing in developed as well as developing regions, such as North America and the Asia Pacific.

Epoxy is estimated to be the largest resin type segment of the electronic adhesives market.

Epoxy resin in electronic adhesives held the largest market share in 2021 in terms of value. The most frequently used resin type for electronic applications is epoxy, either two-part or single-part heat cure products. Occasionally snap-cure epoxies, which cure at a lower temperature than regular single-part epoxies, are used.

These adhesives can be used for bonding components, potting, and encapsulation, among others. Potting compounds are intended to provide a high level of the guard to PCBs and electronic devices by surrounding them in a thick, durable polymer. Epoxy is used when extreme operating conditions require optimum protection.

Asia Pacific is forecasted to be the fastest-growing electronic adhesives market during the forecast period.

Asia Pacific is the largest market for electronic adhesives, and this dominance is expected to continue during the forecast period. High economic growth rate, growing manufacturing industries, cheap labor, increasing electronic adhesives patents, and global shift of consumption and production capacity from the developed markets to the emerging markets in the region are the factors leading to the growth of the electronic adhesives market in Asia Pacific.

The region's market is driven by high economic growth and heavy investments in the automotive, industrial, and medical industries. Its growing middle-class population plays an important role in driving various industries, which has led to industrialization in the region.

Market Dynamics

Drivers

• Increasing Demand for Miniaturization/Automation of Electronic Devices
• Growing Applications in Automotive Industry
• Increased Demand for Waterproof Smartphones and Wearable Devices
• Introduction of 5G Infrastructure
• Growing Demand for Electronic Adhesives in Asia-Pacific

Restraints

• Volatility in Raw Material Prices
• Gradual Shift in Demand and Production Capacity to Developing Countries

Opportunities

• Regulations on Usage of Lead Soldering Materials
• Technological Advancements in the Electronic Assembly Industry of North America

Challenges

• Stringent Environmental Regulations
• Miniaturization of Devices Generating Demand for Higher-Performance Adhesives

Companies Mentioned

• Altana AG (Elantas)
• Arkema SA
• Atom Adhesives
• Bondline Electronic Adhesives, Inc.
• Boyd Corporation
• Delo Industrie Klebstoffe GmbH & Co. KGaA
• Dymax Corporation
• Element Solutions Inc.
• H.B. Fuller Company
• Henkel AG
• Huntsman International LLC
• LG Chemical Limited
• Master Bond Inc.
• Meridian Adhesives Group
• Momentive Performance Materials Inc.
• Panacol-Elosol GmbH
• Panasonic Corporation
• Parker Hannifin Corporation (Lord Corporation)
• Permabond LLC
• Rogers Corporation
• Scapa Group PLC
• Sika AG
• The 3M Company
• The Dow Chemical Company
• Threebond Co. Ltd.
• Wacker Chemie
• Xiamen Weldbond New Material Co. Ltd.

For more information about this report visit https://www.researchandmarkets.com/r/x85zoy