2019 Analysis on the Nokia Flexi MultiRadio 10 Base Station TDD LTE FSIH Baseband Unit - ResearchAndMarkets.com

DUBLIN--()--The "Nokia Flexi MultiRadio 10 Base Station TDD LTE FSIH Baseband Unit" report from EJL Wireless Research has been added to ResearchAndMarkets.com's offering.

This report provides a comprehensive analysis for the Nokia Networks Flexi MultiRadio 10 TDD LTE FSIH Baseband Unit. This product is part of the Flexi System Module release 3 (FSMr3) platform and supports only TDD LTE technology and is primarily an indoor unit.

Features

  • System Functional Description
  • System Level Block Diagrams
  • High Level Mechanical Analysis
    • Heat Sink
  • High Level PCB Analysis
  • Component Diagrams
    • Semiconductor/component locations on PCB
  • High Level Bill of Materials
    • Semiconductor ICs (ASICs, FPGAs, memory, logic, power, etc.)
    • Passive/other components (Transformers, Power inductors, Power capacitors, power/datacom/optical connectors)
    • Complete Part Number/Marking
    • Component Manufacturer Identification
    • Function Component Description
    • Package Type

Key Topics Covered

EXECUTIVE SUMMARY

CHAPTER 1: NOKIA FLEXI MULTIRADIO 10 SYSTEM

  • Overview of Flexi Multiradio 10

CHAPTER 2: FSIH MECHANICAL ANALYSIS

  • Mechanical Analysis

2.1 Flexi 2.5U Chassis/Casing

2.2 FSIH Core Module

2.3 FSIH Core Heat Sink Assembly

2.4 FBIH Core Heat Sink Assembly

CHAPTER 3: FLEXI SYSTEM INDOOR CONTROL + TRANSPORT BOARD

  • Area A Component Analysis - Power Supply
  • Area B Component Analysis - Control, Timing, & Transport
  • Area C Component Analysis

CHAPTER 4: FLEXI SYSTEM INDOOR BASEBAND SIGNAL PROCESSING BOARD

  • Area A Component Analysis - Power Supply
  • Area B Component Analysis - Baseband Radio Signal Processing
  • Area C Component Analysis

TABLES

Table 1: FSIH PCB Top Area A Bill of Materials

Table 2: FSIH PCB Top Area B Bill of Materials

Table 3: FSIH PCB Top Area B Passive Bill of Materials

Table 4: FSIH PCB Bottom Area C Bill of Materials

Table 5: FBIH PCB Top Area A Bill of Materials

Table 6: FBIH PCB Top Area B Bill of Materials

Table 7: FBIH PCB Top Area B Passives Bill of Materials

Table 8: FBIH PCB Bottom Area C Bill of Materials

EXHIBITS

Exhibit 1: Flexi Multiradio 10 FSIH Site Solution Example

Exhibit 2: Nokia FSIH with 2xFBIH Capacity Expansion Module Units

Exhibit 3: FSIH Basic System Configuration

Exhibit 4: Nokia FSIH System Block Diagram

Exhibit 5: Nokia FBIH Core System Block Diagram

Exhibit 6: FSIH Core System Components

Exhibit 7: Flexi 2.5U Casing, Front

Exhibit 8: Flexi 2.5U Casing, Back (Closed)

Exhibit 9: Flexi 2.5U Casing, Back (Opened)

Exhibit 10: FSIH Casing Fan Unit

Exhibit 11: FSIH Casing Backplane PCB Top (L) and Bottom (R)

Exhibit 12: Flexi 2.5U Casing, Top

Exhibit 13: Flexi 2.5U Casing, Bottom

Exhibit 14: FSIH Core Interface Port Identification

Exhibit 15: FSIH Sub Module Unit, Top View

Exhibit 16: FSIH Sub Module Unit, Bottom View

Exhibit 17: FBIH Sub Module Unit, Top View

Exhibit 18: FBIH Sub Module Unit, Bottom View

Exhibit 19: FSIH Core Module Integration with Sub Modules

Exhibit 20: FSIH Heat Sink Assembly Label

Exhibit 21: FSIH Heat Sink Details

Exhibit 22: FSIH Core Heat Sink Assembly, External View

Exhibit 23: FSIH Core Heat Sink Assembly, Internal View

Exhibit 24: FBIH Heat Sink Assembly Label

Exhibit 25: FBIH Heat Sink Details

Exhibit 26: FBIH Core Heat Sink Assembly, External View

Exhibit 27: FBIH Core Heat Sink Assembly, Internal View

Exhibit 28: FSIH PCB Assembly Label

Exhibit 29: FSIH PCB Part Number Markings

Exhibit 30: FSIH PCB Top View

Exhibit 31: FSIH PCB Bottom View

Exhibit 32: FSIH PCB Top Area A Component Diagram

Exhibit 33: Component ID 12 Daughter Card

Exhibit 34: FSIH OCXO Shielding External (L) and Detail (R)

Exhibit 35: FSIH OCXO Cover Internal (L) and Shielding Internal (R)

Exhibit 36: FSIH OCXO Sources

Exhibit 37: FSIH PCB Top Area B Component Diagram

Exhibit 38: FSIH PCB Top Area B Passive Component Diagram

Exhibit 39: FSIH PCB Bottom Area C Component Diagram

Exhibit 40: FBIH PCB Assembly Label

Exhibit 41: FBIH PCB Part Number Markings

Exhibit 42: FBIH PCB Top View

Exhibit 43: FBIH PCB Bottom View

Exhibit 44: FBIH PCB Top Area A Component Diagram

Exhibit 45: FBIH PCB Top Area B Component Diagram

Exhibit 46: FBIH PCB Top Area B Passives Component Diagram

Exhibit 47: FBIH PCB Bottom Area C Component Diagram

For more information about this report visit https://www.researchandmarkets.com/r/86t3ge

Contacts

ResearchAndMarkets.com
Laura Wood, Senior Press Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900

Contacts

ResearchAndMarkets.com
Laura Wood, Senior Press Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900