DUBLIN--(BUSINESS WIRE)--The "The Market for Thermal Management Technologies" report has been added to ResearchAndMarkets.com's offering.
The scope of this report is broad, covering several product areas.
The individual materials, hardware, and software product segments are presented in terms of market size and revenue trends. The revenue forecasts are explained in terms of the key market issues for that product segment and are projected through 2023. The application sections feature forecasts for the most important applications by product.
The technology discussion concentrates on trends that will develop more significantly during the forecast period. The report also includes a discussion of the competitive aspects of each product segment, along with several successful suppliers' strategies in the market.
A survey of recent U.S. thermal management patents that are pending and profiles of a selection of the leading thermal management suppliers are also included.
Topics Covered
Chapter 1 Introduction
Chapter 2 Summary & Highlights
Chapter 3 Technology & Market Background
Chapter 4 Market Summary
Chapter 5 Thermal Management Materials & Technology
Chapter 6 Thermal Management Hardware
Chapter 7 Thermal Management Software
Chapter 8 Thermal Interface Materials
Chapter 9 Thermal Management Substrates
Chapter 10 Patents
Chapter 11 Industry Structure & Market Trends
Chapter 12 Company Profiles
- Aavid Thermalloy
- AI Technology
- Ansys
- Asetek A/S
- Calmark
- Coining Inc.
- Comair Rotron
- Cooler Master
- Coolit Systems
- Dynatron
- EBM-Papst
- Enertron
- ETRI
- Knrr GmbH
- Kooltronic
- Laird Technologies
- Liebert Corp.
- Liquidcool Solutions
- Lord Corp.
- Lytron
- Master Bond
- Materion Corp.
- MSC Software
- Noren Products
- Nuventix Inc.
- OSE
- Parker Hannifin Corp.
- Pfannenberg Inc.
- Tellurex
- Tennmax
- U-Square Corp.
- U.S. Toyo Fan Corp.
- Unitrack Industries
- Vortec
-
and more...
For more information about this report visit https://www.researchandmarkets.com/research/dd3r7q/the_market_for?w=4
