The analysts forecast the global high-bandwidth memory market to grow at a CAGR of 32.09% during the period 2018-2022.
High-bandwidth memory (HBM) is a dynamic random-access memory (DRAM) technology approved by the Joint Electron Device Engineering Council (JEDEC) as an industry standard. The technology uses through-silicon vias (TSVs) and a silicon interposer technology to interconnect stacked DRAM dies.
The report covers the present scenario and the growth prospects of the global high-bandwidth memory market for 2018-2022. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.
One trend in the market is growth of AI. The development in neutral networks, deep learning, and AI algorithms has increased exponentially. The number of pilot programs and proof-of-concepts conducted by firms in the field of AI is increasing.
One driver in the market is increasing demand for HPC. HPC systems are used for tasks that cannot be resolved using conventional computing. With the increasing interest in big data, as well as the rapid increase in the number of data centers, we can expect an increase in the demand for HPC systems, as they are required to process large amounts of information.
The report states that one challenge in the market is exorbitant costs. HBM is highly expensive as compared with other interfaces such as GDDR5 and GDRR6. This is limiting its adoption in several sectors. For a GPU, the die and memory account for majority of the overall cost.
- Advanced Micro Devices
- SK HYNIX
Key Topics Covered:
01. Executive Summary
02. Scope Of The Report
03. Research Methodology
04. Market Landscape
05. Market Sizing
06. Five Forces Analysis
07. Market Segmentation By Application
08. Market Segmentation By Product
09. Customer Landscape
10. Regional Landscape
11. Decision Framework
12. Drivers And Challenges
13. Market Trends
14. Vendor Landscape
15. Vendor Analysis
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