Hermetic Packaging (Multilayer Ceramic, Metal Can, and Pressed Ceramic Packages): Global Market Forecasts to 2023 - ResearchAndMarkets.com

DUBLIN--()--The "Hermetic Packaging Market by Configuration (Multilayer Ceramic, Metal Can, and Pressed Ceramic Packages), Type (Ceramic-Metal and Glass-Metal Sealing), End-User Industry, Geography - Global Forecast to 2023" report has been added to ResearchAndMarkets.com's offering.

According to the forecast the overall hermetic packaging market is estimated at USD 3.25 Billion in 2018 and is expected to reach USD 4.52 Billion by 2023, growing at a CAGR of 6.8% between 2018 and 2023. The key factors driving this market is growing need of protecting highly sensitive electronic components from extraneous particles, such as moisture, atmospheric pressure, and soil/grime; and strong demand for hermetically packaged components from the industries such as automotive, electronics, and aeronautics.

This report segments the hermetic packaging market on the basis of configuration, type, application, industry, and geography. The market, on the basis of configuration, is driven by high adoption rate of the multilayer ceramic packages for high frequency applications such as data communication, wireless communication, and optical communication, as multilayer ceramic packages offer better hermeticity than other configurations for high-frequency applications, and also enable a large number of electrical feedthroughs within small spaces.

The hermetic market for ceramic-metal (CERTM) sealing is expected to hold a major share and grow at the highest CAGR between 2018 and 2023. Growing demand for thermal shock-resistant and low-porosity type of hermetic packaging material is the key factor that propels the growth of the said market. The CERTM sealed sensors, such as heating-ventilation-air conditioning (HVAC) sensors, chassis level sensors, and differential non-contacting sensors, are finding potential applications in the automotive industry as they assure the safety of the passengers while offering failure-free operation.

Based on application, the market for transistors is expected to hold a major share during the forecast period. The hermetically sealed transistors are mainly used for designing telecommunication circuits and home appliances. This is a key driving factor for the said market. However, the market for microelectromechanical system (MEMS) switches is expected to grow at the highest rate during the forecast period.

Companies Mentioned

  • Ametek
  • Amkor
  • CHI
  • Coat-X
  • Complete Hermetics
  • Egide
  • Hermetic Solutions Group
  • Intersil
  • Kyocera
  • Legacy Technologies
  • Materion
  • Micross Components
  • Primoceler
  • SGA Technologies
  • SHP
  • Schott
  • Stratedge
  • Teledyne Microelectronics
  • Texas Instruments
  • Willow Technologies

Key Topics Covered

1 Introduction

2 Research Methodology

3 Executive Summary

4 Premium Insights

5 Market Overview

6 Hermetic Packaging Market, By Configuration

7 Hermetic Packaging Market, By Type

8 Hermetic Packaging Market, By Application

9 Hermetic Packaging Market, By Industry

10 Geographic Analysis

11 Competitive Landscape

12 Company Profiles

For more information about this report visit https://www.researchandmarkets.com/research/t3nz2k/hermetic?w=4

Contacts

ResearchAndMarkets.com
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
Related Topics: Packaging

Contacts

ResearchAndMarkets.com
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
Related Topics: Packaging